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Size Effect in the Shear-Coupled Migration of Grain Boundaries Pinned by Triple Junctions

Published online by Cambridge University Press:  31 January 2011

Javier Gil Sevillano ,
Aitor Luque ,
Javier Aldazabal  and
José Manuel Martinez-Esnaola
Javier Gil Sevillano
Affiliation:
[email protected], CEIT and TECNUN, University of Navarra, Materials Engineering, San Sebastián, Spain
Aitor Luque
Affiliation:
[email protected], CEIT and TECNUN, University of Navarra, Materials Engineering, San Sebastián, Spain
Javier Aldazabal
Affiliation:
[email protected], CEIT and TECNUN, University of Navarra, Materials Engineering, San Sebastián, Spain
José Manuel Martinez-Esnaola
Affiliation:
[email protected], CEIT and TECNUN, University of Navarra, Materials Engineering, San Sebastián, Spain
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Abstract

This paper presents molecular dynamics simulations of shear-coupled migration of tilt boundaries pinned by triple junctions in a simple model structure of columnar grains of different sizes. Simulations are for copper at 300 K. The phenomenon is of interest as a possible explanation of the Hall-Petch relationship breakdown in nano-grained polycrystals deformed at high or moderate strain rate and low-temperature.

Keywords

grain boundariesnanostructuresimulation
Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 1224: Symposia FF/GG – Mechanical Behavior at Small Scales — Experiments and Modeling , 2009 , 1224-GG07-03
Copyright
Copyright © Materials Research Society 2010

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