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Single Crystal Growth of Gallium Nitride Substrates Using an High Pressure High Temperature Process

Published online by Cambridge University Press:  15 March 2011

Rajiv K. Singh
Affiliation:
Department of Materials Science and Engineering, University of Florida, Gainesville, FL
Donald R. Gilbert
Affiliation:
Department of Materials Science and Engineering, University of Florida, Gainesville, FL
Francis Kelly
Affiliation:
Department of Materials Science and Engineering, University of Florida, Gainesville, FL
Robert Chodelka
Affiliation:
Department of Materials Science and Engineering, University of Florida, Gainesville, FL
Reza Abbaschian
Affiliation:
Department of Materials Science and Engineering, University of Florida, Gainesville, FL
Stephen Pearton
Affiliation:
Department of Materials Science and Engineering, University of Florida, Gainesville, FL
Alexander Novikov
Affiliation:
The Gemesis Corporation, Gainesville, FL
Nikolay Patrin
Affiliation:
The Gemesis Corporation, Gainesville, FL
John Budai
Affiliation:
Oak Ridge National Laboratory, Oak Ridge, TN
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Abstract

The use of standard bulk semiconductor crystal growth processes for the production of GaN is prohibited by both the high melt temperature of GaN and thermal decomposition of the compound into Ga metal and N2 gas. We have employed a novel hydrostatic pressure system to grow GaN crystals. A high temperature, ultra-high pressure process was developed using a solid-phase nitrogen source to form GaN crystals in a Ga metal melt. Using a thermal gradient diffusion process, in which nitrogen dissolves in the high temperature region of the metal melt and diffuses to the lower temperature, lower solubility region, high quality crystals up to ∼1 mm in size were formed, as determined by SEM, X-ray diffraction and micro-Raman analysis.

Type
Research Article
Copyright
Copyright © Materials Research Society 2000

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References

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