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Single Asperity Wear and Stress-Assisted Dissolution of Copper

Published online by Cambridge University Press:  01 February 2011

Bun H Chua ,
Abhijit Chandra  and
Pranav Shrotriya
Bun H Chua
Affiliation:
[email protected], Iowa State University, Mechanical Engineering Department, 2025 Black Engineering Building, Ames, IA, 50011, United States
Abhijit Chandra
Affiliation:
[email protected], Iowa State University, Mechanical Engineering Department, 2025 Black Engineering Building, Ames, IA, 50011, United States
Pranav Shrotriya
Affiliation:
[email protected], Iowa State University, Mechanical Engineering Department, 2025 Black Engineering Building, Ames, IA, 50011, United States
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Abstract

The focus of this paper is to investigate the synergistic influence of contact loads, surface stress state and chemical environment on material removal during mechanical stimulation of copper surface. A unique setup is used to generate well characterized stress states on a polished copper specimen. Stressed surface of copper specimen is stimulated using tip of the atomic force microscope (AFM) and material removed during stimulation is measured as a function of contact loads, surface stress state and chemical environment. Measured material removal rates display a complex dependence on contact pressures and in-plane stress state which changes as the pH of chemical environment changes from acidic to basic. A surface material removal mechanism based on a single asperity wear and stress-assisted dissolution is proposed to explain the experimental observations

Keywords

Cusurface reactionCMP
Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 1025: Symposium B – Nanoscale Phenomena in Functional Materials by Scanning Probe Microscopy , 2007 , 1025-B16-04
Copyright
Copyright © Materials Research Society 2008

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