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Silicon Precipitate Detection in Al-Si and Al-Si-Cu Metal Interconnect by Thermal Wave Imaging

Published online by Cambridge University Press:  25 February 2011

K. N. Ritz ,
C. G. Welles ,
W. L. Smith  and
A. Bivas
K. N. Ritz
Affiliation:
Therma-Wave Inc., 47320 Mission Falls Court, Fremont, CA 94539
C. G. Welles
Affiliation:
Therma-Wave Inc., 47320 Mission Falls Court, Fremont, CA 94539
W. L. Smith
Affiliation:
Therma-Wave Inc., 47320 Mission Falls Court, Fremont, CA 94539
A. Bivas
Affiliation:
Therma-Wave Inc., 47320 Mission Falls Court, Fremont, CA 94539
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Abstract

Controlling the size and distribution of silicon precipitates in aluminum alloy depositions is important for yield enhancement and reliability of small geometry metal interconnects. A non-contact and non-destructive thermal wave imaging technique is used to detect and evaluate size and density of silicon precipitates in AISi and AlSiCu alloys. The thermal wave results are corroborated with SEM and Auger data.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 260: Symposium C – Advanced Metallization and Processing for Semiconductor Devices and Circuits , 1992 , 593
Copyright
Copyright © Materials Research Society 1992

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References

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