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Sample Preparation of Aluminum Bridge Test Vehicles for Tem In-Situ Crystallographic Studies of Electromigration

Published online by Cambridge University Press:  21 February 2011

W. E. Rhoden ,
J. V. Maskowitz ,
D. R. Kitchen ,
R. E. Omlor  and
P. F. Lloyd
W. E. Rhoden
Affiliation:
Air Force Institute of Technology, WPAFB, OH 45433
J. V. Maskowitz
Affiliation:
Air Force Institute of Technology, WPAFB, OH 45433
D. R. Kitchen
Affiliation:
Air Force Institute of Technology, WPAFB, OH 45433
R. E. Omlor
Affiliation:
Systems Research Laboratories, 2800 Indian Ripple Rd., Dayton, OH 45440
P. F. Lloyd
Affiliation:
Systems Research Laboratories, 2800 Indian Ripple Rd., Dayton, OH 45440
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Introduction

Electromigration in aluminum films has been identified as an increasing concern for integrated circuit reliability. Electromigration is the mass transport of atoms in a conductor under a current stress. Electromigration occurs in conductors experiencing current densities greater than 105 A/cm2 and is accelerated by high temperature. The damage to aluminum films manifests itself in the formation of voids, hillocks and whiskers along the conductor. This paper presents a test vehicle preparation procedure which can be used to investigate electromigration.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 115: Symposium W – Specimen Preparation for Transmission Electron Microscopy of Materials I , 1987 , 173
Copyright
Copyright © Materials Research Society 1988

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References

REFERENCES

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