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Rf Magnetron Sputter Deposition and Characterization of Aluminum Nitride thin Films

Published online by Cambridge University Press:  26 February 2011

Saluru B. Krupanidhi*
Affiliation:
Motorola Inc., Albuquerque, NM 87109
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Abstract

Highly crystalline and resistive thin films of aluminum nitride have been rf magnetron sputter deposited. The films were characterized in terms of structure, electrical and optical properties. A perfect c-axis orientation along (002) direction was obtained, in the reactive sputtered films from a metal target, keeping the substrates as low as 350°C. The structural and electrical properties were observed to be sensitive to deposition conditions. It has also been observed that the combination of higher powers and low sputtering pressures, exposed the films to high energy neutral ion bombardment. A correlation between deposition parameters and the physical properties is presented.

Type
Articles
Copyright
Copyright © Materials Research Society 1987

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References

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