Published online by Cambridge University Press: 10 February 2011
Thin platinum layer was used for the modification of the interface state between (Ba,Sr)TiO3 (BST) thin films and RuO2 bottom electrodes. Pt/RuO2 hybrid bottom electrodes were fabricated with various platinum deposition temperatures by a conventional dc magnetron sputtering method. Although the surface morphology and XRD patterns of BST thin films were not changed, the electrical properties of BST films deposited on Pt/RuO2 hybrid electrodes were improved compared to the films on RuO2 electrodes. Dielectric constant (εr) and leakage current density of BST thin films on Pt/RuO2 hybrid electrodes prepared at the platinum deposition temperature of 400°C were 498 and 8.6 × 10−8 A/cm2 at 1.5V, respectively.