Hostname: page-component-669899f699-swprf Total loading time: 0 Render date: 2025-05-05T04:26:18.420Z Has data issue: false hasContentIssue false
  • English
  • Français

Relaxation of New-Tpi Thermoplastic Polyimide Studied byThermally Stimulated Depolarization Current

Published online by Cambridge University Press:  15 February 2011

Sharon X. Lu ,
Wendy C. Russell  and
Peggy Cebe
Sharon X. Lu
Affiliation:
Department of Materials Science and Engineering, Massachusetts Institute of Technology, Cambridge, MA 02139
Wendy C. Russell
Affiliation:
Department of Materials Science and Engineering, Massachusetts Institute of Technology, Cambridge, MA 02139
Peggy Cebe
Affiliation:
Department of Materials Science and Engineering, Massachusetts Institute of Technology, Cambridge, MA 02139
Get access

Abstract

Semicrystalline polyimide, Regulus™ NEW-TPI, is a thermoplastic polyimideproduced by mitsui Toatsu. This aromatic polyimide possesses outstandingheat resistance, high tensile strength, excellent electrical properties, andstrong solvent resistance. It has become the subject of recent study in ourgroup [1–6] and others [7–13]. The flexible ether and meta linkages in themonomer unit lower its glass transition temperature (Tg) to 250°C inquenched amorphous material.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 321: Symposium E – Crystallization and Related Phenomena in Amorphous Materials—Ceramics, Metals, Polymers, and Semiconductors , 1993 , 197
Copyright
Copyright © Materials Research Society 1994

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

Article purchase

Temporarily unavailable

References

REFERENCES

1. Huo, P.P. and Cebe, P., Polymer 34, 696 (1993).Google Scholar
2. Huo, P.P. and Cebe, P., Colloid Polym. Sci. 270, 840 (1992).Google Scholar
3. Friler, J.B. and Cebe, P., Polym. Eng. & Sci. 33, 587 (1993).Google Scholar
4. Aihara, Y. and Cebe, P., Polym. Eng. Sci., in press (1993).Google Scholar
5. Huo, P.P., Friler, J.B. and Cebe, P., Polymer 34, 4387 (1993).Google Scholar
6. Lu, S.X. and Cebe, P., Polvm. Prepr., (American Chem. Soc, 1994), in press.Google Scholar
7. Hou, T.H. and Reddy, R.M., SAMPE Q. 38, January (1991).Google Scholar
8. Hsiao, B., Sauer, B. and Biswas, A., J. Poly Sci.: Poly. Phys., in press (1993).Google Scholar
9. Mitsui-Toatsu, Chem., Inc. Tokyo, Japan. Technical Data SheetA-00.Google Scholar
10. Sakaitani, H., Okuyama, K. and Arikawa, H., Poly. Prepr. Jpn. 40, 478 (1991).Google Scholar
11. Yuasa, S., Truji, M. and Takahashi, T., Polym. Prepr. Jpn 40 (1–4), 491 (1991).Google Scholar
12. Sasuga, T., Polymer 32, 1539 (1991).Google Scholar
13. Hergenrother, P.M., SPE Conference on High Temperature Polymers and Their Uses. (Case Western Reserve University, 1989).Google Scholar
14. Braunlich, P., Thermally Stimulated Relaxation in Solids. 1st ed. (Springer-Verlag, Berlin, 1979).Google Scholar
15. Ibar, J.P., Denning, P., Thomas, T., Bernes, A., de Goys, C., Saffell, J.R., Jones, P. and Lacabanne, C., Advances in Chemistry Series No. 227, Polym. Characterization: Phys. Prop., Spectroscopie, and Chromatographie Methods, American Chemical Society 227, 167 (1990).Google Scholar
16. Chung, J.S. and Cebe, P., Polymer 33, 2312 (1992).Google Scholar
17. Chung, J.S. and Cebe, P., Polymer 33, 2325 (1992).Google Scholar
18. van Turnhout, J., Polym. J. 2, 173 (1971).Google Scholar