No CrossRef data available.
Article contents
Recent Achievement in the GaN Epitaxy on Silicon and Engineering Substrates
Published online by Cambridge University Press: 01 February 2011
Abstract
Since the middle of the 90's, GaN epitaxy techniques have been developed, using either MOCVD or MBE growth methods. A low cost approach is presented aiming at satisfying thermal issues encountered on conventional substrates such as SiC, Sapphire and more recently Silicon. Domain of application are being covered with their associated challenges: RF and High Power applications. Stress engineering is one of the key parameters.
Keywords
- Type
- Research Article
- Information
- Copyright
- Copyright © Materials Research Society 2009
References
REFERENCES
[2].
Bove, P., Lahreche, H., Da Cruz, D., Faure, B., Letertre, F., Boussagol, A., “Progress in Microwave GaN HEMTs on Silicon and Smart Cut™ engineered substrates for high power applications”, CSMAX 2004 Monterey USGoogle Scholar
[3].
Bove, P., Lahreche, H., Thuret, J., Letertre, F., Faure, B., “Manufacturing Engineered wafers for GaN RF power application”, GAASMANTECH 2005
Google Scholar
[4].
Cioccio, L.Di., Letertre, F., Le Tiec, Y., Papon, A.M., Jaussaud, C., Bruel, M., “Silicon Carbide on Insulator formation by Smart Cut process”, Mat. Sci. and Eng. B Vol. 46 (1997), p. 349
Google Scholar
[5].
Faure, B., Boussagol, A., Letertre, F., Lahreche, H., Bressot, S., Da Cruz, D., and Bove, P., “Recent progress on Engineered Substrates for GaN microelectronic applications”, 207th ECS meeting proceedings (2005)Google Scholar