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Real time in-situ stress evolution investigation of highly textured electrodeposited bismuth thin films

Published online by Cambridge University Press:  15 February 2011

Donglei Fan ,
Frank Q. Zhu ,
Ingrid X. Shao ,
P. C. Searson  and
R. C. Cammarata
Donglei Fan
Affiliation:
Department of Materials Science and Engineering
Frank Q. Zhu
Affiliation:
Department of Physics and Astronomy Johns Hopkins University, Baltimore, MD, 21218, USA
Ingrid X. Shao
Affiliation:
Department of Materials Science and Engineering
P. C. Searson
Affiliation:
Department of Materials Science and Engineering
R. C. Cammarata
Affiliation:
Department of Materials Science and Engineering
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Abstract

Bismuth, a semi-metal with very long mean free path and large magnetoresistance (MR) effect, is a novel candidate material for thin film spintronic devices. Electrochemical deposition followed by a post-deposition anneal has resulted in highly textured bismuth films as characterized by x-ray diffractometry and pole figure measurements. A highly sensitive, real time in-situ stress measurement system was designed and employed to study stress generation during bismuth film growth. Bismuth films displayed a monotonically increasing compressive stress during deposition. The magnitude of the compressive stress decreased with the deposition rate in the range 1.5 Å/sec to 50 Å/sec.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 781: Symposium Z – Mechanisms in Electrochemical Deposition and Corrosion , 2003 , Z4.2
Copyright
Copyright © Materials Research Society 2003

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