Hostname: page-component-586b7cd67f-2brh9 Total loading time: 0 Render date: 2024-11-29T09:13:24.120Z Has data issue: false hasContentIssue false

Radiation Damage Induced Transient Enhanced Diffusion of Dopants in Silicon

Published online by Cambridge University Press:  28 February 2011

R. Angelucci
Affiliation:
CNR - Istituto LAMEL, Via Castagnoli, 1 - 40126 Bologna (Italy)
E. Gabilli
Affiliation:
CNR - Istituto LAMEL, Via Castagnoli, 1 - 40126 Bologna (Italy)
R. Lotti
Affiliation:
CNR - Istituto LAMEL, Via Castagnoli, 1 - 40126 Bologna (Italy)
P. Negrini
Affiliation:
CNR - Istituto LAMEL, Via Castagnoli, 1 - 40126 Bologna (Italy)
M. Servidori
Affiliation:
CNR - Istituto LAMEL, Via Castagnoli, 1 - 40126 Bologna (Italy)
S. Solmi
Affiliation:
CNR - Istituto LAMEL, Via Castagnoli, 1 - 40126 Bologna (Italy)
M. Anderle
Affiliation:
Divisione di Scienza dei Materiali, IRST - 38050 Povo, Trento (Italy)
Get access

Abstract

Transient enhanced diffusion is observed for P, As and Sb as a consequence of the recovery of the damage created by a silicon dose below the amorphization threshold. The phenomenon results more pronounced for low temperature furnace heating than after rapid thermal annealing and for those elements having a larger component of interstitialcy diffusion mechanism.

A close correlation was found between the trends of the anomalous dopant diffusion and the implant damage evolution analyzed by X-ray diffraction. This evolution takes place via interstitial cluster dissolution.

Type
Articles
Copyright
Copyright © Materials Research Society 1987

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

1 Morehead, F.F. and Hogdson, R.T., “Energy Beam-Solid Interaction and Transient Thermal Processing 1984” (Materials Research Society, Pittsburgh PA) 35, 341 (1984)Google Scholar
2 Angelucci, R., Negrini, P. and Solmi, S., Appl.Phys.Lett., in press.Google Scholar
3 Michel, A.E. “Rapid Thermal Processing” (Materials Research Society, Pittsburgh PA) 52, 3 (1986)Google Scholar
4 Servidori, M., Angelucci, R., Cembali, F., Negrini, P., Solmi, S., Zaumseil, P. and Winter, U., J.Appl.Phys., in pressGoogle Scholar
5 Cembali, F., Servidori, M. and Zani, A., Solid-St.Electron 28, 933 (1985)Google Scholar
6 Meda, L., Cerofolini, G.F. and Ottaviani, G., Proc. of IBMM Int.Conf., Catania (Italy) 1986, Nucl.Instr. and Methods, in press.Google Scholar
7 Oehrlein, G.S., Cohen, S.A. and Sedgwick, T.O., Appl.Phys.Lett. 45, 417 (984)Google Scholar
8 Angelucci, R., Cembali, F., Negrini, P., Servidori, M. and Solmi, S., to be published.Google Scholar