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Quick Tests for Electromigration: Useful but not without Danger

Published online by Cambridge University Press:  25 February 2011

J. R. Lloyd
J. R. Lloyd*
Affiliation:
Digital Equipment Corporation, 77 Reed Road, Hudson MA 01749–2895 USA Max Planck Institut für Metallforschung, Institut für Werkstoffwissenschaft, Seestraβe 71, D-7000, Stuttgart 1, Germany
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Extract

Traditional electromigration life testing is a time-consuming and often painful process, consuming many expensive samples and weeks of valuable time to collect enough data for a statistically significant conclusion. Annoying, to say the least, this often causes real problems in process development when cycle times of new products can often be measured in months. Therefore, there has been a strong incentive to search for alternatives.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 260: Symposium C – Advanced Metallization and Processing for Semiconductor Devices and Circuits , 1992 , 735
Copyright
Copyright © Materials Research Society 1992

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References

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