Hostname: page-component-586b7cd67f-tf8b9 Total loading time: 0 Render date: 2024-11-23T14:34:50.886Z Has data issue: false hasContentIssue false

Pulsed-Laser Deposition of TiNi Shape Memory Alloy Thin Films

Published online by Cambridge University Press:  21 March 2011

X.Y. Chen
Affiliation:
Laser Microprocessing Laboratory, Department of Electrical & Computer Engineering and Data Storage Institute, National University of Singapore, 10 Kent Ridge Crescent, Singapore119260
Y.F. Lu
Affiliation:
Laser Microprocessing Laboratory, Department of Electrical & Computer Engineering and Data Storage Institute, National University of Singapore, 10 Kent Ridge Crescent, Singapore 119260 email: [email protected]; fax: +65-779-1103
Z.M. Ren
Affiliation:
Laser Microprocessing Laboratory, Department of Electrical & Computer Engineering and Data Storage Institute, National University of Singapore, 10 Kent Ridge Crescent, Singapore119260
L. Zhang
Affiliation:
Laser Microprocessing Laboratory, Department of Electrical & Computer Engineering and Data Storage Institute, National University of Singapore, 10 Kent Ridge Crescent, Singapore119260
J.P. Wang
Affiliation:
Laser Microprocessing Laboratory, Department of Electrical & Computer Engineering and Data Storage Institute, National University of Singapore, 10 Kent Ridge Crescent, Singapore119260
T.Y.F. Liew
Affiliation:
Laser Microprocessing Laboratory, Department of Electrical & Computer Engineering and Data Storage Institute, National University of Singapore, 10 Kent Ridge Crescent, Singapore119260
Get access

Abstract

Thin films of TiNi shape memory alloy (SMA) have been prepared by pulsed-laser deposition (PLD) at different substrate temperatures. The stoichiometry, crystallinity, and morphology of the deposited films were characterized by X-ray photoelectron spectroscopy (XPS), X-ray diffraction (XRD) and atom force microscopy (AFM). The transformation behavior and crystallization temperatures were investigated by differential scanning calorimetry (DSC). It is found that the Ni content of the deposited films ranges from 46.7 to 52.0 at.%. The crystallization temperature of the amorphous films is around 460°C. The activation energy of the crystallization process is determined by Kissinger's method to be 301 kJ/mol. The martensitic transformation temperature of the annealed Ti-51.5 at.% Ni film is –20.8°C.

Type
Research Article
Copyright
Copyright © Materials Research Society 2001

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

REFERENCES

1. Ishida, A. and Miyazaki, S., ASME J. Eng. Mater. Technol. 121, 2 (1999).Google Scholar
2. Ikuta, K., Hayashi, M., Matsuura, T. and Fujishiro, H., Proc. IEEE Micro Electro Mechanical Systems, (Oiso, Japan, 25-29 Jan., 1994), pp. 355360.Google Scholar
3. Busch, J.D., Johnson, A.D., Lee, C.H. and Stevenson, D.A., J. Appl. Phys. 68, 6224 (1990).Google Scholar
4. Chen, LC., in Pulsed Laser Deposition of Thin Films, edited by Chrisey, D.B. and Hubler, G.K. (Wiley, New York, 1994), pp. 176177.Google Scholar
5. Ciabattari, F., Fuso, F. and Arimondo, E., Appl. Phys. A 64, 623 (1997).Google Scholar
6. Kissinger, H.E., Anal. Chem. 29, 1702 (1957).Google Scholar
7. Buschow, K.H.J., J. Phys. F: Met. Phys. 13, 563 (1983).Google Scholar
8. Specifying NiTi Materials File (Shape Memory Applications Inc., San Jose, CA, USA, 1998).Google Scholar
9. Funakubo, H., Shape Memory Alloys, translated by Kennedy, J.B. (Gordon and Breach Science Publishers, New York, 1987), pp. 6870.Google Scholar