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Properties of Graphite Interconnect Circuit Boards with Anisotropic Thermal Expansion

Published online by Cambridge University Press:  25 February 2011

J. Malamas ,
R.P. Bambha ,
J.B. Ramsey Jr. ,
W.C. Garrett ,
E.G. Kelso  and
T.A. Hahn
J. Malamas
Affiliation:
U.S. Army Center for Night Vision and Electro-Optics, Fort Belvoir, VA 22060-5677
R.P. Bambha
Affiliation:
U.S. Army Center for Night Vision and Electro-Optics, Fort Belvoir, VA 22060-5677
J.B. Ramsey Jr.
Affiliation:
U.S. Army Center for Night Vision and Electro-Optics, Fort Belvoir, VA 22060-5677
W.C. Garrett
Affiliation:
U.S. Army Center for Night Vision and Electro-Optics, Fort Belvoir, VA 22060-5677
E.G. Kelso
Affiliation:
U.S. Army Center for Night Vision and Electro-Optics, Fort Belvoir, VA 22060-5677
T.A. Hahn
Affiliation:
Naval Research Laboratory, Washington, D.C. 20375
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Abstract

We report the investigation of an interconnect circuit board (ICB) with anisotropic thermal expansion for use with bump bonded, indirect hybrid, scanning focal plane arrays. This ICB is designed to reduce significantly the thermal stresses on the indium bump bonds during thermal cycling. Highly oriented pyrolitic graphite (HOPG) was chosen because its anisotropic thermal expansion meets the criteria for forming an indirect hybrid ICB using silicon processor circuits and mecury cadmium telluride detectors. Properties of HOPG influencing its performance as an ICB have been investigated including thermal expansion, electrical conductivity, durability, and adherence of electrically insulating thin films.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 216: Symposium T – Long-Wavelength Semiconductor Devices, Materials and Processes , 1990 , 385
Copyright
Copyright © Materials Research Society 1991

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References

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