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Production Scale Growth of AlGaN/GaN Field Effect Transistors

Published online by Cambridge University Press:  21 March 2011

David Gotthold*
Affiliation:
EMCORE Corporation, Somerset, NJ 08873
Shawn Gibb
Affiliation:
EMCORE Corporation, Somerset, NJ 08873
Boris Peres
Affiliation:
EMCORE Corporation, Somerset, NJ 08873
Ian Ferguson
Affiliation:
Now at School of ECE, Georgia Institute of Technology, Atlanta, GA 30332
Chris Palmer
Affiliation:
EMCORE Corporation, Somerset, NJ 08873
Eric Armour
Affiliation:
EMCORE Corporation, Somerset, NJ 08873
*
*Corresponding email: [email protected]
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Abstract

This paper addresses issues with the manufacturability of AlGaN/GaN FET structures. A robust Metalorganic Chemical Vapor Deposition growth process has been developed that will now allow reliability measurements to be obtained on the resulting devices. During a small scale production run mobilities in excess of 1600 cm2/V.s, sheet charge (Ns) between 0.8x1013 and 1.2x1013 cm-2, and Rs<400 Ω/square with less than 2% variation across the wafer and less than 0.5% variation from wafer to wafer were obtained. Issues for producing a manufacturable process on sapphire and semi-insulating SiC substrates using in-situ monitoring will be addressed. The equivalence of growth on sapphire and SiC substrates for process optimization will be shown.

Type
Research Article
Copyright
Copyright © Materials Research Society 2002

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References

1 Eastman, Lester F., Shealy, J. Richard, Tilak, V., Smart, J., Green, B., and Prunty, T., “AlGaN/GaN HEMT Microwave CW Power Limits”, Presented at The Fourth International Conference on Nitride Semiconductors (ICNS-4), Denver CO, USA July 16-20, 2001 Google Scholar
2 Müller, G., Krötz, G., and Schalk, J., “New Sensors for Automotive and Aerospace Applications”, Phys. Stat. Sol. A, 185, No. 1, pp. 114, 2001 10.1002/1521-396X(200105)185:1<1::AID-PSSA1>3.0.CO;2-U3.0.CO;2-U>Google Scholar
3 Yoshida, S. and Ishii, H. – “Fabrication of a High Power GaN Metal Semiconductor Field Effect TransistorMat.Res.Soc.Symp.Proc. Vol. 639 G13.4.1 (2001)Google Scholar
4 Heying, B., Wu, X.H., Keller, S., Li, Y., Kapolnek, D., Keller, B.P., DenBaars, S.P., and Speck, J.S., “Role of threading dislocation structure on the x-ray diffraction peak widths in epitaxial GaN films”, Applied Physics Letters, 68 (5) pp. 643645, 1996 Google Scholar
5 Ambacher, O., Foutz, B., Smart, J., Shealy, J.R., Weimann, N.G., Chu, K., Murphy, M., Sierakowski, A.J., Schaff, W.J., Eastman, L.F., Dimitrov, R., Mitchell, A., and Stutzmann, M., “Two dimensional electron gases induced by spontaneous and piezoelectric polarization in undoped and doped AlGaN/GaN heterostructures”, Journal of Applied Physics, 87 (1), pp. 334344, 2000.10.1063/1.371866Google Scholar
6 Bykhovski, A.D., Gelmont, B.L., and Shur, M.S.Elastic strain relaxation and piezoeffect in GaN-AlN, GaN-AlGaN, and GaN-InGaN superlattices”, Journal of Applied Physics, 81 (9), pp. 63326338, 1997 Google Scholar
7 Kim, C., Je, J., Yi, M., Noh, D. – “Structural Evolution of GaN during initial stage MOCVD growth” Unpublished paper (1999)Google Scholar
8 Amano, H., Iwaya, M., Hayashi, N., Kashima, T., Katsuragawa, M., Takeuchi, T., Wetzel, C., and Akasaki, I. –“Improvement of Crystalline Quality of Group III Nitrides on Sapphire using Low Temperature Interlayers” MRS Internet J. Nitride Semicond. Res. 4S1, G10.1 (1999)Google Scholar
9 Yang, T., Uchida, K., Mishima, T., Kasai, J. – “Control of Initial Nucleation by Reducing the V/III Ratio during the Early Stages of GaN GrowthPhys. stat. sol. (a) 180, 45 (2000)10.1002/1521-396X(200007)180:1<45::AID-PSSA45>3.0.CO;2-53.0.CO;2-5>Google Scholar