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The Processing and Properties of Multilayer Interconnection Structures Using Thermoset Films Derived from Bisbenzocyclobutene.

Published online by Cambridge University Press:  21 February 2011

P. H. Townsend ,
D. C. Burdeaux ,
S. F. Hahn ,
M. Thomsen  and
J. N. Carr
P. H. Townsend
Affiliation:
The Dow Chemical Company, M. E. Pruitt Research Center, 1712 Building, Midland, MI 48674.
D. C. Burdeaux
Affiliation:
The Dow Chemical Company, M. E. Pruitt Research Center, 1712 Building, Midland, MI 48674.
S. F. Hahn
Affiliation:
The Dow Chemical Company, M. E. Pruitt Research Center, 1712 Building, Midland, MI 48674.
M. Thomsen
Affiliation:
The Dow Chemical Company, M. E. Pruitt Research Center, 1712 Building, Midland, MI 48674.
J. N. Carr
Affiliation:
The Dow Chemical Company, M. E. Pruitt Research Center, 1712 Building, Midland, MI 48674.
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Abstract

Multilayer interconnection structures incorporating a novel polymeric dielectric derived from a bis-benzocyclobutene(bis-BCB) monomer have been fabricated. This paper discusses the processing conditions for the construction of these circuits and describes electrical characteristics of the dielectric layers. The relative dielectric constant of the BCB film was 2.7. Thermal cycling produced no significant change in the conductance of three level metal via chains through two layers of the polymer.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 154: Symposium K – Electronic Packaging Materials Science IV , 1989 , 47
Copyright
Copyright © Materials Research Society 1989

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References

1. Messner, G., IEEE Trans. Components, Hybrids and Manufacturing Tech., CHMT–10, 143 (1987).Google Scholar
2. Hahn, S. F., Townsend, P. H., Burdeaux, D. C., and Gilpin, J. A., “The Fabrication and Properties of Thermoset Films Derived from Bisbenzocyclobutene for Multilayer Applications”, Proceedings of the ACS Division of Polymeric Materials: Science and Engineering, 59, 190, 1988.Google Scholar