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Pore Structure and Integration Performance of a Porous CVD Ultra Low k Dielectric

Published online by Cambridge University Press:  01 February 2011

Youfan Liu ,
Andreas Knorr ,
Wen-Li Wu ,
David Gidley  and
Bernd Kastenmeier
Youfan Liu
Affiliation:
Intel Assignee at SEMATECH
Andreas Knorr
Affiliation:
Infineon Assignee at SEMATECH
Wen-Li Wu
Affiliation:
NIST, University of Michigan, and
David Gidley
Affiliation:
IBM Assignee at SEMATECH
Bernd Kastenmeier
Affiliation:
2706 Montopolis Drive, Austin, TX 78741-6499
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Abstract

A porous ultra low k PECVD dielectric has been evaluated at SEMATECH for 45 nm and beyond technology node applications. Material structure, integration performance, and electrical characteristics were investigated in a one level metal single damascene integrated structure.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 863: Symposium B – Materials, Technology and Reliability of Advanced Interconnects , 2005 , B3.1
Copyright
Copyright © Materials Research Society 2005

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References

1. Wu, Wen-liet al, 2003 SEMATECH low k workshop, and references therein.Google Scholar
2. Gidley, David W.et al. 2003 SEMATECH low k workshop, and references therein.Google Scholar
3. Liu, Youfanet. al. Proceedings of AMC 2003, p.531–536 Google Scholar