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Polyimide for Multichip Modules: Materials and Process Challenges

Published online by Cambridge University Press:  15 February 2011

T. Rucker ,
V. Murali ,
R. Shukla  and
H. Neuhaus
T. Rucker
Affiliation:
Intel Corp., Santa Clara, CA
V. Murali
Affiliation:
Intel Corp., Santa Clara, CA
R. Shukla
Affiliation:
Intel Corp., Santa Clara, CA
H. Neuhaus
Affiliation:
Amoco Chemical Co., Naperville, Il
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Abstract:

As the performance of desk-top systems approaches 100 Mhz there is a need to develop a packaging technology capable of supporting high speed chip to chip interconnections. Polyimide based multichip modules are excellent packaging solutions that have minimum propagation delays and are cost effective. This paper presents the material properties and processing issues that need to be addressed in building reliable modules. A cost effective and reliable packaging solution is described in detail.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 264: Symposium G – Electronic Packaging Materials Science VI , 1992 , 71
Copyright
Copyright © Materials Research Society 1992

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References

References:

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