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Polyimide as a Plastic Substrate for the Flexible Organic Electroluminescent Device

Published online by Cambridge University Press:  17 March 2011

Jin-Woo Park
Affiliation:
Department of Polymer Science and Engineering, Pusan National University, Busan 609 -735, Korea
Youngkyoo Kim
Affiliation:
EXSS Group, Department of Physics, The Blackett Laboratory, Imperial College London, Prince Consort Road, London SW7 2BW, UK
Hyuntaek Lim
Affiliation:
Device Team, NESS Display Co., Ltd., Yongin P.O.BOX 25, Kyoung Gi-Do, 449-860, Korea
Cheol Min Bae
Affiliation:
Department of Polymer Science and Engineering, Pusan National University, Busan 609 -735, Korea
Il Kim
Affiliation:
Department of Polymer Science and Engineering, Pusan National University, Busan 609 -735, Korea
Shinji Ando
Affiliation:
Department of Organic and Polymer Materials, Tokyo Institute of Technology, Ookayama, Meguro-Ku, Tokyo 152-8552, Japan
Chang-Sik Ha
Affiliation:
Department of Polymer Science and Engineering, Pusan National University, Busan 609 -735, Korea
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Abstract

In this work, transparent flexible substrates based on polyimides(PI) with indium tin oxide (ITO) thin films for organic electroluminescent devices have been prepared. 2,2'-bis-(3,4- dicarboxyphenyl) hexafluoropropanedianhydride (6FDA) and 2,2'-bis-(trifluoromethyl)-4,4'- diaminobiphenyl (TFDB) PI films were used for transparent flexible substrates. ITO thin films were prepared at two substrate deposition temperatures of 25°C and 150°C with a typical radio- frequency (r.f.) planar magnetron sputtering system. The sheet resistance and the optical transmission properties of the fluorinated PI substrate were comparable with those for the slide glass substrate. The substrate properties are better when the deposition temperature is higher. SiO2 coating onto the fluorinated PI substrate by sol-gel reaction was also attempted to improve the optical transmission of the ITO/PI substrate. It was found that the coating of SiO2 affected on the morphology of the PI substrates.

Type
Research Article
Copyright
Copyright © Materials Research Society 2004

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