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Plasticity in Copper Thin Films

Published online by Cambridge University Press:  10 February 2011

V. Weihnacht  and
W. Brückner
V. Weihnacht
Affiliation:
Institute of Solid State and Materials Research Dresden, Helmholtzstrasse 20, D-01069 Dresden/Germany, [email protected]
W. Brückner
Affiliation:
Institute of Solid State and Materials Research Dresden, Helmholtzstrasse 20, D-01069 Dresden/Germany, [email protected]
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Abstract

Plastic deformation in thin Cu films was studied by stress measurements with the wafercurvature technique during thermal cycling and in combination with four-point bending. The results from 0.5 ¼m and 1 ¼m thick Cu films are compared. In thermal cycling experiments, strengthening during cooling and a Bauschinger-like effect during reheating were observed. The stress-strain behavior investigated by four-point bending showed to be asymmetric regarding tension and compression at lower temperatures. These phenomenons are explained by a dislocation arrangement at the film-substrate interface which has formed during a previous thermal cycle.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 594: Symposium V – Thin Films - Stresses & Mechanical Properties VIII , 1999 , 87
Copyright
Copyright © Materials Research Society 2000

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References

REFERENCES

1. Venkatraman, R. and Bravman, J.C., J. Mater. Res. 7, 2040 (1992).Google Scholar
2. Nix, W.D., Metall. Trans. A 20A, 2217 (1989).Google Scholar
3. Freund, L.B., J. Appl. Mech. 54, 553 (1987).Google Scholar
4. Hommel, M., Kraft, O., and Arzt, E., J. Mater. Res. 14, 2373 (1999).Google Scholar
5. Macionczyk, F., Brückner, W., Pitschke, W., and Reiss, G., J. Mater. Res. 13, 2852 (1998).Google Scholar
6. Kretschmann, A., Kuschke, W.-M., Baker, S.P., and Arzt, E., Mater. Res. Soc. Symp. Proc. 463, 59 (1997).Google Scholar
7. Weihnacht, V. and Br¨ckner, W., Proc. of Fifth Int. Workshop on Stress Induced Phenomena in Metallization, Stuttgart (Germany) 1999, AlP Conf. Proc. 491, 283 (1999).Google Scholar
8. Stoney, G., Proc. R. Soc. London A 82, 172 (1909).Google Scholar
9. Baker, S.P., Keller, R.-M., and Arzt, E., Mater. Res. Soc. Symp. Proc. 505, 605 (1998).Google Scholar
10. Thouless, M.D., Gupta, J., and Harper, J.M.E., J. Mater. Res. 8, 1845 (1993).Google Scholar
11. Weihnacht, V. and Brickner, W., submitted to J. Mater. Res.Google Scholar
12. Venkatraman, R., Chen, S., and Bravman, J.C., J. Vac. Sci. Technol. A 9, 2536 (1991).Google Scholar