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Phase Formation in the Pt/Inp Thin Film System

Published online by Cambridge University Press:  25 February 2011

D. A. Olson
Affiliation:
Materials and Chemical Sciences Division, Lawrence Berkeley Laboratory, Berkeley, California 94720 T. Sands, Bellcore, 331 Newman Springs Rd., Red Bank, New Jersey 07701
K. M. Yu
Affiliation:
Materials and Chemical Sciences Division, Lawrence Berkeley Laboratory, Berkeley, California 94720 T. Sands, Bellcore, 331 Newman Springs Rd., Red Bank, New Jersey 07701
J. Washburn
Affiliation:
Materials and Chemical Sciences Division, Lawrence Berkeley Laboratory, Berkeley, California 94720 T. Sands, Bellcore, 331 Newman Springs Rd., Red Bank, New Jersey 07701
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Abstract

InP substrates with 40nm metal films of Pt were encapsulated in SiO2, and isochronally annealed up to 600°C in flowing forming gas. The composition and morphology of the phases that formed were studied using x-ray diffraction, Rutherford Backscattering, and transmission electron microscopy.

Results show that the Pt/InP system begins interacting at 300°C. TEM analysis of the 350°C anneal shows unreacted Pt and and additional polycrystalline phases, with no observed orientation relationship with the substrate. The Pt layer has been completely consumed by 400°C, with a uniform reacted layer indicated by RBS. At high temperatures (between 500°C and 600°C), the reaction products are PtIn2 and PtP2. The two phases show a tendency for phase separation, with a higher concentration of PtP2 at the InP/reacted layer interface. The phosphide phase also shows a preferred orientation relationship with the substrate.

Type
Research Article
Copyright
Copyright © Materials Research Society 1989

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References

[1] Williams, R. H., Varma, R. R., and Montgomery, V., Journal of Vacuum Science and Technology, 16(5), 1979, 1418.Google Scholar
[2] Spicer, W. E., Lindau, I., Skeath, P., Su, C. Y., and Chye, P., Physical Review Letters 44(6), 1980, 420.CrossRefGoogle Scholar
[3] Freeouf, J. L. and Woodall, J. M., Applied Physics Letters 39, 1981, 727.Google Scholar
[4] Brillson, L. J., Brucker, C. F., Katnani, A. D., Stoffel, N. G., Daniels, R., and Margaritondo, G., Journal of Vacuum Science and Technology, 21(2), 1982, 564.Google Scholar
[5] Lile, D. L., Journal of Vacuum Science and Technology B, 2(3), 1984, 496.CrossRefGoogle Scholar
[6] Robinson, G. Y., Physics and Chemistry of III-V Compound Semiconductor Interfaces (Wilmsen, C. W., ed.) p. 73, Plenum Press, New York (1985).Google Scholar
[7] Bahir, G., Merz, J. L., Abelson, J. R., and Sigmon, T. W., Journal of Electronic Materials, 16(4), 1987, 257.CrossRefGoogle Scholar
[8] Lince, J. R. and Williams, R. S., Journal of Vacuum Science and Technology B, 3(4), 1985, 1217.Google Scholar
[9] Beyers, R., Kim, K. B., and Sinclair, R., Journal of Applied Physics, 61(6), 1987, 2195.Google Scholar
[10] Brasen, D., Karlicek, R. F., and Donnelly, V. M., Journal of the Electrochemical Society, 130(7), 1983, 1473.Google Scholar
[11] Kumar, V., Journal of the Physics and Chemistry of Solids, 36, 1975, 535.Google Scholar
[12] Sinha, A. K. and Poate, J. M., Thin Films- Interdiffusion and Reactions (Poate, J. M., Tu, K. N., and Mayer, J. W., eds.) p. 416, John Wiley and Sons, New York, (1978).Google Scholar
[13] Fontaine, C., Okumura, T. and Tu, K. N., Journal of Applied Physics, 54, 1983, 1404.Google Scholar
[14] Sands, T., Keramidas, V. G., Yu, A. J., Yu, K. M., Gronsky, R., and Washburn, J., Journal of Materials Research, 2, 1987, 262.Google Scholar