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Phase Equilibria in Complex Solder Systems

Published online by Cambridge University Press:  25 February 2011

M. R. Notis ,
S. K. Tarby  and
T. Cawley
M. R. Notis
Affiliation:
Department of Materials Science and Engineering, Lehigh University, Bethlehem, PA 18015
S. K. Tarby
Affiliation:
Department of Materials Science and Engineering, Lehigh University, Bethlehem, PA 18015
T. Cawley
Affiliation:
Department of Materials Science and Engineering, Lehigh University, Bethlehem, PA 18015
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Abstract

Ternary solder alloys have come into wide use in chip bonding, printed circuit board connection, and in ceramic package sealing applications. Little is known concerning phase equilibria in many of these systems. Methods for predicting phase equilibria in the ternary (Pb+Sn)+Ag system using CAD (computer aided design) are described, and a predicted value for the ternary eutectic temperature is compared with values obtained by differential scanning calorimetry (DSC) for this system.

Type
Articles
Information
MRS Online Proceedings Library (OPL) , Volume 72: Symposium G – Electronic Packaging Materials Science II , 1986 , 277
Copyright
Copyright © Materials Research Society 1986

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References

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