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Patterned Macrovoids for Dielectric Constant Control of High Frequency Circuit Substrates
Published online by Cambridge University Press: 25 February 2011
Abstract
Fugitive ink and tape technology permit the inclusion of flat voids at predetermined locations in ceramic microcircuit substrates. Calculations show that critical stray capacitances can be reduced by as much as 65% and the propagation delay of microstrip transmission lines by 30% and more. The selectivity of the void location permits the retention of the full thermal conductance of the substrate under heat dissipating elements.
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