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Pad Asperity Parameters for CMP Process Simulation

Published online by Cambridge University Press:  15 March 2011

Takafumi Yoshida
Takafumi Yoshida*
Affiliation:
YNT-jp.Com 2-10-17 Asae, Hikari, Yamaguchi 743-0021, Japan
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Abstract

This paper reviews the contact mechanics between the surface of a wafer and the asperity of the polishing pad for CMP from basic asperity such as spherical, rectangular, and conical shapes to more general asperity with a height distribution. This paper also proposes a practical method to bridge a measured profile of pad asperity in microscopic scale to a set of simple parameters which describe the elastic behavior for CMP process simulation in larger scale. We show a scalable CMP simulation using the proposed pad asperity parameters.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 816: Symposium K – Advances in Chemical-Mechanical Polishing , 2004 , K8.4
Copyright
Copyright © Materials Research Society 2004

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