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Overview of Hybrid Circuits

Published online by Cambridge University Press:  22 February 2011

Morris Berg
Morris Berg*
Affiliation:
Teresco Inc., 15 Colony West Drive. Champaign, Illinois 61820
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Abstract

This presentation will review the development of hybrid circuit technology, a technology which is now widely accepted for all types of electronic products. The industry has matured and is predicted to show steady growth in the future.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 40: Symposium J – Electronic Packaging Materials Science I , 1984 , 61
Copyright
Copyright © Materials Research Society 1985

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References

1. Brunetti, C., Curtis, R. W., “Printed Circuit Techniques,” Proc. IRE, 36,121 (1948).CrossRefGoogle Scholar
2. Taylor, P. K., “Micro-Module Production Program” First Quarter Report (MM-206) Signal Corps. Contract DA-36-039-SC-75968, PB-146042, July 1, 1958.Google Scholar
3. Allen, R. V., “Forecasting the Hybrid Microelectronics Market by Technology and Function,” The International Journal for Hybrid Microelectronics, 6,190 (1983).Google Scholar
4. Hicks, R. E., Charles, H. K., Jr., Wagner, G. D., and Romenesko, B. M., “Trends in Medical Electronics Using Surface Mounted Components and Hybrids,” The International Journal for Hybrid Microelectronics, 6,283 (1983).Google Scholar
5. Totta, P. A. and Sopher, R. P., “SLT Device Metallurgy and its Monolithic Extension,” IBM Journal Research and Development, 13,226, (1969).CrossRefGoogle Scholar