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Optical Waveguides Embedded in PCBs - A Real World Application of 3D Structures Written by TPA

Published online by Cambridge University Press:  01 February 2011

Ruth Houbertz
Affiliation:
[email protected], Fraunhofer ISC, Hybrid Materials for Microsystems and Micromedicine, Neunerplatz 2, Wuerzburg, 97082, Germany
Herbert Wolter
Affiliation:
[email protected], Fraunhofer ISC, Hybrid Materials for Microsystems and Micromedicine, Neunerplatz 2, Wuerzburg, 97082, Germany
Volker Schmidt
Affiliation:
[email protected], Joanneum Research, Institute of Nanostructured Materials and Photonics NMP, Franz-Pichler-Str. 30, Weiz, 8160, Austria
Ladislav Kuna
Affiliation:
[email protected], Joanneum Research, Institute of Nanostructured Materials and Photonics NMP, Franz-Pichler-Str. 30, Weiz, 8160, Austria
Valentin Satzinger
Affiliation:
[email protected], Joanneum Research, Institute of Nanostructured Materials and Photonics NMP, Franz-Pichler-Str. 30, Weiz, 8160, Austria
Christoph Wüchter
Affiliation:
[email protected], Fraunhofer IOF, Microoptics, Albert-Einstein-Str. 7, Jena, 07445, Germany
Gregor Langer
Affiliation:
[email protected], Austria Technologie & Systemtechnik, Fabriksgasse 13, Leoben, 8700, Austria
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Abstract

The integration of optical interconnects in printed circuit boards (PCB) is a rapidly growing field worldwide due to a continuously increasing need for high-speed data transfer. There are any concepts discussed, among which are the integration of optical fibers or the generation of waveguides by UV lithography, embossing, or direct laser writing. The devices presented so far require many different materials and process steps, but particularly also highly-sophisticated assembly steps in order to couple the optoelectronic elements to the generated waveguides. In order to overcome these restrictions, an innovative approach is presented which allows the embedding of optoelectronic components and the generation of optical waveguides in only one optical material. This material is an inorganic-organic hybrid polymer, in which the waveguides are processed by two-photon absorption (TPA) processes, initiated by ultra-short laser pulses. In particular, due to this integration and the possibility of in situ positioning the optical waveguides with respect to the optoelectronic components by the TPA process, no complex packaging or assembly is necessary. Thus, the number of necessary processing steps is significantly reduced, which also contributes to the saving of resources such as energy or solvents. The material properties and the underlying processes will be discussed with respect to optical data transfer in PCBs.

Type
Research Article
Copyright
Copyright © Materials Research Society 2008

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