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Optical Interconnect Components for Wafer Level HeterogeneousHyper-Integration

Published online by Cambridge University Press:  17 March 2011

P. D. Persans ,
M. Ojha ,
R. J. Gutmann ,
J.-Q. Lu ,
A. Filin  and
J. Plawsky
P. D. Persans
Affiliation:
Focus Research Center: Interconnections for Gigascale Integration Rensselaer Polytechnic Institute, Troy, New York 12180, U.S.A
M. Ojha
Affiliation:
Focus Research Center: Interconnections for Gigascale Integration Rensselaer Polytechnic Institute, Troy, New York 12180, U.S.A
R. J. Gutmann
Affiliation:
Focus Research Center: Interconnections for Gigascale Integration Rensselaer Polytechnic Institute, Troy, New York 12180, U.S.A
J.-Q. Lu
Affiliation:
Focus Research Center: Interconnections for Gigascale Integration Rensselaer Polytechnic Institute, Troy, New York 12180, U.S.A
A. Filin
Affiliation:
Focus Research Center: Interconnections for Gigascale Integration Rensselaer Polytechnic Institute, Troy, New York 12180, U.S.A
J. Plawsky
Affiliation:
Focus Research Center: Interconnections for Gigascale Integration Rensselaer Polytechnic Institute, Troy, New York 12180, U.S.A
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Abstract

Optical waveguides for three-dimensionally stacked chip fabricationtechnologies, in which optical connection between layers plays a centralrole, are described. CMOS-compatible approaches to optical via and waveguidefabrication are addressed. Detailed modeling is used for design optimizationand also addresses how manufacturing variations from ideal design may affectdevice performance.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 812: Symposium F – Materials, Technology and Reliability for Advanced Interconnects and Low-k Dielectrics-2004 , 2004 , F6.11
Copyright
Copyright © Materials Research Society 2004

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References

1. Lu, J.-Q., Kwon, Y., McMahon, J.J., Jindal, A., Altemus, B., Cheng, D., Eisenbraun, E., Cale, T.S., and Gutmann, R.J., in Proceedings of 20th International VLSI Multilevel interconnection Conference (VMIC 2003), edited by Wade, T., IMIC, 2003, pp. 227–236.Google Scholar
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