Hostname: page-component-586b7cd67f-tf8b9 Total loading time: 0 Render date: 2024-11-29T10:36:35.519Z Has data issue: false hasContentIssue false
  • English
  • Français

Open Air Fabrication of Al2O3 Thin Films at Room Temperature

Published online by Cambridge University Press:  10 February 2011

T. Okamoto ,
K. Toyoda  and
M. Murahara
T. Okamoto
Affiliation:
Faculty of Electrical Engineering, Tokai University 1117 Kitakaname, Hiratsuka, Kanagawa, 259–12, JAPAN
K. Toyoda
Affiliation:
Applied Electronics, Science University of Tokyo 2641 Yamazaki, Noda, Chiba, 278, JAPAN
M. Murahara
Affiliation:
Faculty of Electrical Engineering, Tokai University 1117 Kitakaname, Hiratsuka, Kanagawa, 259–12, JAPAN
Get access

Abstract

A thin layer of water or hydrogen peroxide solution, which was formed on a pure aluminum substrate, was photodissociated by ArF excimer laser( λ =193nm) or Xe2* excimer lamp (λ = 172nm) light to photochemically oxidize the surface of aluminum substrate. The layer was formed by a capillary phenomenon between the substrate and a fused silica glass as an entrance window of ultraviolet light. Then, the layer was photodissociated by the excimer laser or the excimer lamp light irradiation to generate active oxygen; the surface oxidization was performed by the photo-induced active oxygen. The surface before and after modification was evaluated by the XPS analysis; the high densed photo-oxidization film was confirmed on the modified surface, compared with a natural oxidization film Furthermore, the contact angle with water became remarkably small, and it is seen that the treated surface was quite densely oxidized.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 451: Symposium P – Electrochemical Synthesis and Modification , 1996 , 533
Copyright
Copyright © Materials Research Society 1997

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

REFERENCES

1. Kruishoop, J.C. W., Philips Technical Review, Vol. 29, No.2, 37 (1968)Google Scholar
2. Tibol, G. J. and Holi, R. W., J. Electrochem. Soc. Vol. 111, No. 12, 1368 (1964)Google Scholar
3. Bohni, H., Uhling, H., J. Electrochem. Soc, 116, 906 (1969)Google Scholar
4. Hanabusa, M. and Sahara, K., Mat. Res. Soc. Symp. Proc, Vol. 201, 607 (1991)Google Scholar
5. Frbanzen, W., Tetreault, T., Kosik, W., Groft, W. and Hirvonen, J. K., Mat. Res. Soc. Proc. Vol. 279. 825 (1993)Google Scholar
6. Murahara, M. and Okoshi, M., J. Adhesion Sci. Technol., Vol.9, No. 12, 1593 (1995)Google Scholar
7. Okoshi, M., Kashiura, H., Miyokawa, T., Toyoda, K. and Murahara, M., Mat. Ree. Soc. Symp. Proc., Vol.279, 737 (1993)Google Scholar
8. Murahara, M., Okoshi, M. and Toyoda, K., SPIE, Vol.2207, 577 (1994)Google Scholar
9. Miyokawa, T., Okoshi, M., Toyoda, K. and Murahara, M., Mat. Res. Soc. Symp. Proc. Vol. 334, 87(1994)Google Scholar