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On the Role of the Underlying Microstructure on the Mechanical Properties of Microelectromechanical Systems (MEMS) Materials

Published online by Cambridge University Press:  17 March 2011

G. F. Dirras
Affiliation:
Mechanical Engineering and Chemistry Departments, The Johns Hopkins University3400 N. Charles Street, Baltimore, MD 21218, USA Visiting from LPMTM-CNRS, Institut Galilée, Université Paris XIII 93430 Villetaneuse, FRANCE
G. Coles
Affiliation:
Mechanical Engineering and Chemistry Departments, The Johns Hopkins University3400 N. Charles Street, Baltimore, MD 21218, USA
A. J. Wagner
Affiliation:
Chemistry Departments, The Johns Hopkins University3400 N. Charles Street, Baltimore, MD 21218, USA
S. Carlo
Affiliation:
Chemistry Departments, The Johns Hopkins University3400 N. Charles Street, Baltimore, MD 21218, USA
C. Newman
Affiliation:
Chemistry Departments, The Johns Hopkins University3400 N. Charles Street, Baltimore, MD 21218, USA
K. J. Hemker
Affiliation:
Mechanical Engineering and Chemistry Departments, The Johns Hopkins University3400 N. Charles Street, Baltimore, MD 21218, USA
W. N. Sharpe Jr
Affiliation:
Mechanical Engineering and Chemistry Departments, The Johns Hopkins University3400 N. Charles Street, Baltimore, MD 21218, USA
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Abstract

The microstructure of Low Pressure Chemical Vapor Deposition (LPCVD) Polycrystalline silicon (Polysilicon) thin films was investigated by means of scanning electron microscopy (SEM), transmission electron microscopy (TEM), X-ray diffraction (XRD), atomic force microscopy (AFM) and Auger electron spectroscopy (AES). SEM characterization of tensile tested samples showed a brittle like-rupture, along with grooves located at the surface sides of the sample. TEM investigations of as-deposited samples showed equiaxed or fully columnar grains bridging from the bottom to the top of the films. A microstructural coarsening was observed with annealing. In the as-deposited state, the films exhibited a {110} texture as showed by the XRD analysis. The films' top and bottom surfaces were observed to be smooth with a roughness (standard deviation) of about 11nm and 20 nm respectively. A chemical analysis of the thin films showed the presence of carbon and oxygen impurities on the surface and oxygen through the sample as observed in the depth profile. The hypothetical influence of these findings is subsequently discussed in relation to the measured mechanical properties.

Type
Research Article
Copyright
Copyright © Materials Research Society 2001

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References

REFERENCES

[1] Kamins, T., J. Mater. Res. Soc., 106, 3 (1987).Google Scholar
[2] Kamins, T., J. Electrochem.Soc., 127, 686 (1980).Google Scholar
[3] Hasegawa, S., Arai, M. and Kurata, Y, J. Appl. Phys. 71 3 (1992).Google Scholar
[4] Guckel, H., Burns, D., Visser, C. C. G., Tilmans, H.A.C. and Deroo, D., IEEE Trans. Electron Devices, 35, 800 (1988).Google Scholar
[5] French, P.J., Drienenhuizen, B.P., Poenar, D., Goosen, J.F.L., Mallee, R., Sarro, P. M. and Wolffenbuttel, R.F., IEEE J. Microelectromech. Syst., 5, 187 (1996).Google Scholar
[6] Madou, M., Fundamentals of Microfabrication, CRC Press (1997).Google Scholar
[7] Legros, M., Kumar, M., Jayaraman, S., Hemker, K.J. and Sharpe, W.N. Jr., J. Mater. Res. Soc. 472, 275 (1997).Google Scholar
[8] Jayaraman, S., Edwards, R. L. and Hemker, K. J., J. Mater. Res., 14 (1999).Google Scholar
[9] Krulevitch, P., Nguyen, T. D., Johnson, G.C., Howe, R.T., Wenk, H.R. and Gronsky, R., Mater. Res. Soc., 202, 167 (1991).Google Scholar
[10] Krulevitch, P., Johnson, G.C. and Howe, R.T., J. Mater. Res. Soc., 239, 13 (1992).Google Scholar
[11] Sharpe, W. N. Jr., Jackson, K. M., Coles, G., Eby, G. and Edwards, R. L., Mechanical Properties of Structural Films, ASTM STP 1413, Muhlstein and Brown, S. B. Eds, (2000).Google Scholar
[12] LaVan, D. A., Tsuchiya, Toshiyuki and Coles, G., Mechanical properties of Structural Films, ASTM, STP 1413, American Society For Testing and Materials, submitted (2000).Google Scholar
[13] Ghandi, S.K., “Native oxide films” in VLSI Fabrication Principles. New York: Wiley, (1983).Google Scholar
[15] Arsdell, W.W. Van and Brown, Stuart B., IEEE J. Microelectromech. Syst., 8, 319 (1999).Google Scholar