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Nucleation and Growth of Ultrathin Epitaxial Metal Silicides on Silicon

Published online by Cambridge University Press:  26 February 2011

J. L. Batstone
Affiliation:
AT&T Bell Laboratories, 600 Mountain Ave., Murray Hill, NJ 07974
R. T. Tung
Affiliation:
AT&T Bell Laboratories, 600 Mountain Ave., Murray Hill, NJ 07974
Julia M. Phillips
Affiliation:
AT&T Bell Laboratories, 600 Mountain Ave., Murray Hill, NJ 07974
J. M. Gibson
Affiliation:
AT&T Bell Laboratories, 600 Mountain Ave., Murray Hill, NJ 07974
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Abstract

Growth of epitaxial single crystal nickel and cobalt disilicide films on silicon is performed under UHV conditions by deposition of Co or Ni on silicon followed by a high temperature reaction to form the silicide. The uniformity and perfection of ultrathin epitaxial layers has been studied using transmission electron microscopy. Mechanisms controlling island growth are discussed. Island nucleation observed in pseudomorphic films of NiSi2 /Si(100) (∼60Å thick) is shown to be the result of the difference in symmetry between the NiSi2 and Si. Islands related by a translation vector a/4<111> show an equilibrium island separation of 15±1.5Å. The boundary between islands is described as a coreless defect. In comparison,, pseudomorphic layers of CoSi2 /Si(111) are observed up to thicknesses ∼30Å. Pinholes are commonly observed in CoSi2 /Si(111) thin films. Finite contact angles (∼50) between substrate and deposit suggest a desire for three-dimensional growth under equilibrium conditions.

Type
Research Article
Copyright
Copyright © Materials Research Society 1988

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References

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