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A Novel Photosensitive Polyimide

Published online by Cambridge University Press:  25 February 2011

Takashi Hirano ,
Nobuyuki Sashida ,
Toshiro Takeda  and
Akira Tokoh
Takashi Hirano
Affiliation:
SUMITOMO BAKELITE CO., LTD. Fundamental Research Laboratory 495 Akiba-cho, Totsuka-ku, Yokohama, Kanagawa 245 Japan
Nobuyuki Sashida
Affiliation:
SUMITOMO BAKELITE CO., LTD. Fundamental Research Laboratory 495 Akiba-cho, Totsuka-ku, Yokohama, Kanagawa 245 Japan
Toshiro Takeda
Affiliation:
SUMITOMO BAKELITE CO., LTD. Fundamental Research Laboratory 495 Akiba-cho, Totsuka-ku, Yokohama, Kanagawa 245 Japan
Akira Tokoh
Affiliation:
SUMITOMO BAKELITE CO., LTD. Fundamental Research Laboratory 495 Akiba-cho, Totsuka-ku, Yokohama, Kanagawa 245 Japan
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Abstract

We developed a novel negative photosensitive polyimide composition for microelectronics. It was prepared by the synthesis of polyamic acid precursor in N, N-dimethly acryl amide. The solution properties, processing conditions and film properties are compared with two conventional, ester and ion type photosensitive polyimides.

The novel composition has higher sensitivity than the other two types because the density of the photoreactive groups is much higher. And it provides wider patterning process range, better adhesion and lower final curing temperature.

We also examined the effect between three types of polyimides and epoxy molding compounds on the reliability of ICs after moisture/solder reflow process. The novel photosensitive composition has good adhesion to metals, inoranic layers and molding compound and improves the reliability of ICs by supressing the interfacial delamination.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 203: Symposium D – Electronic Packaging Materials Science V , 1990 , 255
Copyright
Copyright © Materials Research Society 1991

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References

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