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Novel Fabrication Process for the Integration of MEMS Devices with Thick Amorphous Soft Magnetic Field Concentrators

Published online by Cambridge University Press:  01 February 2011

Simon Brugger ,
Wilhelm Pfleging  and
Oliver Paul
Simon Brugger
Affiliation:
[email protected], University of Freiburg - IMTEK, Department of Microsystems Engineering, Georges-Koehler-Allee 103, Freiburg, D-79110, Germany
Wilhelm Pfleging
Affiliation:
[email protected], Forschungszentrum Karlsruhe GmbH, Institute for Materials Research I, Karlsruhe, 76021, Germany
Oliver Paul
Affiliation:
[email protected], University of Freiburg, Department of Microsystems Engineering (IMTEK), Freiburg, 79110, Germany
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Abstract

This paper reports a novel fabrication process enabling the integration of mechanical MEMS devices with thick amorphous soft magnetic field concentrators. The integration process combines silicon on insulator technology for the MEMS device fabrication and epoxy-resin-based attachment of 18-µm-thick amorphous soft magnetic ribbons followed by a wet chemical structuring process. The fabrication process is reported on the basis of a field-concentrator-based resonant magnetic sensor combining an electrostatically driven micromechanical resonator and a planar magnetic field concentrator with two narrow gaps. For realization of the concentrator gaps, the integration process is extended by micro-patterning of the soft magnetic ribbons via UV-laser ablation using an excimer laser system. The characterization of the fabricated resonant magnetic sensor using a stroboscopic video microscope for in-plane motion measurement shows a high sensitivity of 390 kHz/T at a magnetic flux density of 158 µT.

Keywords

magneticsensoramorphous
Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 1052: Symposium DD – Microelectromechanical Systems–Materials and Devices , 2007 , 1052-DD07-11
Copyright
Copyright © Materials Research Society 2008

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