Published online by Cambridge University Press: 17 March 2011
A novel, non-contact method for determination of ultra-shallow junction sheet resistance and leakage current density has been developed based on monitoring the dynamics of photo-generated carriers by means of spatially separated capacitive probes. At light modulation frequencies of about 100 kHz, spatially resolved surface voltage signals give a direct measure of the junction sheet resistance, independent of the junction depth. At lower light modulation frequencies, the junction leakage current density is determined. Combining capacitive monitoring of modulated photo-generated free carriers with a precision wafer motion stage allows for rapid acquisition of sheet resistance and leakage data for efficient wafer-scale mapping applications.