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Nano-Structural Control of Molecular-Pore Stacked (MPS) SiOCH Films Using Plasma Copolymerization Reaction

Published online by Cambridge University Press:  01 February 2011

Hironori Yamamoto ,
Fuminori Ito ,
Munehiro Tada ,
Tsuneo Takeuchi ,
Naoya Furutake  and
Yoshihiro Hayashi
Hironori Yamamoto
Affiliation:
[email protected], NEC Corporation, System Devices Reseach Laboratories, 1120 Shimokuzawa, Sagamihara, Kanagawa, 229-1198, Japan
Fuminori Ito
Affiliation:
[email protected], NEC Corporation, 1120, Shimokuzawa, Sagamihara, Kanagawa, 229-1198, Japan
Munehiro Tada
Affiliation:
[email protected], NEC Corporation, 1120, Shimokuzawa, Sagamihara, Kanagawa, 229-1198, Japan
Tsuneo Takeuchi
Affiliation:
[email protected], NEC Corporation, 1120, Shimokuzawa, Sagamihara, Kanagawa, 229-1198, Japan
Naoya Furutake
Affiliation:
[email protected], NEC Corporation, 1120, Shimokuzawa, Sagamihara, Kanagawa, 229-1198, Japan
Yoshihiro Hayashi
Affiliation:
[email protected], NEC Corporation, 1120, Shimokuzawa, Sagamihara, Kanagawa, 229-1198, Japan
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Abstract

A novel plasma co-polymerization technology, using flexibly-mixed molecular gas of 6-membered ring-type vinyl-siloxane and 8-member ring-type one, has been developed for new interlayer dielectric film.

Keywords

dielectric propertiespolymerizationsemiconducting
Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 949: Symposium C – Smart Dielectric Polymer Properties, Characterization and Their Devices , 2006 , 0949-C07-10
Copyright
Copyright © Materials Research Society 2007

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References

REFERENCES

1. Hayashi, Y., Proceedings of IEEE IITC 2002, p145.Google Scholar
2. Kawahara, J et al., Tech. Dig. IEDM 2003, p143.Google Scholar
3. Kunimi, N. et al., Proceedings of IEEE IITC 2004, p141.Google Scholar
4. Hayashi, Y. et al., Proceedings of IEEE IITC 2004, p225.Google Scholar
5. Ito, F. et al., Proceedings of AMC 2005 p291.Google Scholar