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Nanoindentation Evaluation of Passive Film Stress and Growth Kinetics

Published online by Cambridge University Press:  10 February 2011

N. I. Tymiak
Affiliation:
CEMS Department, University of Minnesota, Minneapolis, MN 55455, [email protected]
J. C. Nelson
Affiliation:
CEMS Department, University of Minnesota, Minneapolis, MN 55455, [email protected]
W. W. Gerberich
Affiliation:
CEMS Department, University of Minnesota, Minneapolis, MN 55455, [email protected]
D. F. Bahr
Affiliation:
School of Mechanical and Materials Engineering, Washington State University, Pullman, WA.
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Abstract

Load controlled nanoindentation in conjunction with a potential step method were utilized for the investigation of precipitated iron sulfate film stresses and growth. Two types of experiments have been undertaken on thin sheet samples of Fe 3% Si single crystal in IM H2SO4. Samples were either allowed to deflect in the indentation direction or constrained. A distinctive difference between the indentation curves for the above two types of tests allowed separation of the effects of film stresses and local electrochemical processes. A proposed theoretical model accounting for both electrochemical and mechanical effects allowed modeling of the indenter tip motion following a potential step. Within the scope of the model, the time dependent film thickness (3.5 μm at maximum), electrostrictive film stress (330 MPa at maximum) have been determined.

Type
Research Article
Copyright
Copyright © Materials Research Society 1998

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References

1. Sato, N.,., Electrochim. Acta, 16, p. 1683, (1971).Google Scholar
2. Bradhurst, D.H., and Leach, J.S.L., Trans.Br. Ceramic Soc., 62, p.93, (1963).Google Scholar
3. Wu, T.W., J.Mater.Res., 6, p. 407 , (1991).Google Scholar
4. Bahr, D.F, Nelson, J.C,. Tymiak, N.I., and Gerberich, W.W.,.J.Mater. Res., 12, p.3345, (1997).Google Scholar
5. Alkire, R., Ernsberger, D.,.Beck, T., J.Electrochem. Soc., 125, p. 1382, (1978)Google Scholar
6. Orazem, M.E. and Miller, M.G., J.Electrochem. Soc., 341, p. 393, (1987).Google Scholar
7. Beck, T., J. Electrochem. Soc., 129, p. 2412, (1982)Google Scholar
8. Archibald, L.S., Electrochim. Acta, 22, p. 57, (1977).Google Scholar
9. Nelson, J.C.. and Oriani, R.A, Corrosion Science., 34, p. 307, (1993).Google Scholar
10. Teschke, O., Soares, D.M., and Kleinke, M.U.,.Langmuir, 5, p. 1162, (1989).Google Scholar
11. Doener, M.F. and Nix, W.D., J. Mat er. Res., 1, p. 609 , (1986).Google Scholar
12. Tymiak, N.I. Nelson, J.C. Bahr, D.F. and Gerberich, W.W., accepted for publication in Corrosion Science. Google Scholar