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Multiscale Modeling of Mechanical Response of Quantum Nanostructures

Published online by Cambridge University Press:  10 February 2011

Vinod K. Tewary  and
Bo Yang
Vinod K. Tewary
Affiliation:
Materials Reliability DivisionNational Institute of Standards and TechnologyBoulder, Colorado, USA
Bo Yang
Affiliation:
Materials Reliability DivisionNational Institute of Standards and TechnologyBoulder, Colorado, USA
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Abstract

A multiscale Green's function method is described for modeling the mechanical response of quantum nanostructures in semiconductors. The method accounts for the discreteness of the lattice in and around the nanostructure, and uses the continuum Green's function to model extended defects such as free surfaces in the host solid. The method is applied to calculate the displacement field due to a Ge quantum dot in a semi-infinite Si lattice. Corresponding continuum values of the displacement field are also reported.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 778: Symposium U – Mechanical Properties Derived from Nanostructuring Materials , 2003 , U9.2
Copyright
Copyright © Materials Research Society 2002

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References

1. Tewary, V. K., Adv. Phys. 22 757 (1973).Google Scholar
2. Thomson, R., Zhou, S., Carlsson, A. E., and Tewary, V. K., Phys. Rev. B46 10613 (1992).Google Scholar
3. Ting, T. C. T., Anisotropic Elasticity (Oxford University Press, 1996).Google Scholar
4. Ortiz, M. and Phillips, R., Adv. Applied Mech. 36 1 (1999).Google Scholar
5. Vashishta, P., Nakano, A., and Kalia, R.K., Mat. Sci. Eng.- Solids B37 56 (1996).Google Scholar
6. Tadmor, E. B., Ortiz, M., and Phillips, R., Phil. Mag. A73 529 (1996).Google Scholar
7. Rao, S., Hernandez, C., Simmons, J.P., Parthasarathy, T.A., and Woodward, C., Phil. Mag. 77 231 (1998).Google Scholar
8. Phillips, R., Curr Opin Solid St. M 3 526 (1998).Google Scholar
9. Tewary, V. K. in Modeling and numerical simulation of materials behavior and evolution, edited by Zavaliangos, A., Tikare, V., and Olevsky, E. (Mater. Res. Soc. Proc. 731, Pittsburgh, PA, 2002) pp. 21–26.Google Scholar
10. Pan, E., ASME J. Appl. Mech. 70, 101–110 (2003).Google Scholar
11. Tersoff, J., Physical Review B 39, 5566 (1989).Google Scholar
12. Yang, B. and Pan, E., Journal of Applied Physics 92, 3084 (2002).Google Scholar