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Multi-Scale Characterization of Pad Role on Material Removal Rate in CMP
Published online by Cambridge University Press: 01 February 2011
Abstract
A combined experimental and theoretical approach has been devised to understand the mechanical behavior of CMP pad. The pad response is examined at different length scale utilizing a nano-indentation with a conical tip and a flat-punch. The experimentally observed trends showed the competition between the local contact field of the abrasive particle and the global porous pad cell deformation. From the experiments, the local particle-level contact, cell bending, long range pad surface asperity contact as well as the bulk response of the pad can be integrated into mechanism-based models for better understanding the applied force partitioning and to predict the characteristics of the material removal rates.
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- Research Article
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- Copyright © Materials Research Society 2003
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