Hostname: page-component-586b7cd67f-t7czq Total loading time: 0 Render date: 2024-11-29T07:39:38.183Z Has data issue: false hasContentIssue false
  • English
  • Français

Moisture and Plastic Package Stability

Published online by Cambridge University Press:  21 February 2011

K.R. Kinsman ,
W.E. Jahsman  and
R.C. Sundahl
K.R. Kinsman
Affiliation:
Intel Corporation, 145 S. 79th Street, Chandler, Az 85226
W.E. Jahsman
Affiliation:
Intel Corporation, 145 S. 79th Street, Chandler, Az 85226
R.C. Sundahl
Affiliation:
Intel Corporation, 145 S. 79th Street, Chandler, Az 85226
Get access

Abstract

Polymers used to encapsulate microelectronic devices absorb moisture – it's their nature. But only recently, with the growing use of surface mount technologies, has this phenomenon fostered concern much beyond the traditional chemical (corrosion) issues. The mechanical stability of plastic encapsulated components in use is now affected by moisture and its complex relation to interfacial adhesion and stress distributions within the package under different environmental (test) conditions. Strategies to defend against moisture-associated problems involve control of the application environment (removing moisture), improving package structural designs (increasing robustness), and managing materials choice to reduce moisture sensitivity. Each strategy has limitations, both physical and practical (economic), and all currently are being pursued. This paper will review the technical challenges, with particular emphasis on the state of affairs with regard to material development and application.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 154: Symposium K – Electronic Packaging Materials Science IV , 1989 , 131
Copyright
Copyright © Materials Research Society 1989

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

1. Shattacharyya, B.K., Huffman, W.A., Jahsman, W.E., and Natarajan, B., IEEE CHMT Proceedings, 49 (1988).Google Scholar
2. Fukuzawa, I., Ishiguro, S., and Nanbu, S., Proc. IEEE Rel. Physics Symposium, 192 (1985).Google Scholar
3. Steiner, T.D., and Suhl, D., Proc. IEEE CHMT -10, No. 2, 209 (1987).Google Scholar
4. Gordon, S.F., Huffman, W.A., Prough, S., Sandkuhle, R., and Yee, K., IPC Technical Rev., 21, February 1988 Google Scholar
5. Kinsman, K.R., Journal of Metals, June 1988, 23.Google Scholar
6. Lin, R., Blackshear, E., May, G., Hamilton, G., and Kirby, D., Proc. Int'l Elec. Packaging Conference (IEPS), 995 (1987).Google Scholar
7. Oizumi, S., Ito, S., and Suzuki, H., Nitto Technical Reports, September 1987, 40.Google Scholar
8. Kitano, M., Nishimura, A., Kawai, S., and Nishi, K., Proc. IE Rel. Phys. Symposium, 90 (1988).Google Scholar
9. Groothuis, S., Schroen, W.H., and NUrtuza, M., Proc. IE Rel. Phys. Symposium, 182 (1985).Google Scholar
10. Kinsman, K.R., Proc. Elect. Packaging Materials and Process Conference, ed. Nicholson, M., ASM International, 1 (1987).Google Scholar
11. Shoraka, F., Kinsman, K.R., Natarajan, B., and Gealer, C., Proc. Int'l Elec. Packaging Conference (IEPS), 294 (1986).Google Scholar
12. Natarajan, B. and Ehattacharyya, B., Proc. IEEE Elec. Components Conference, 544 (1986).Google Scholar
13. Kinloch, A.J., in Adv. in Polymer Science 72, ed. Dusek, K. (Springer- Verlag, New York, 1985) p. 46.Google Scholar
14. Kinloch, A.J., Jnl. Adh., 10, 193 (1979).Google Scholar
15. Venables, J.D., McNamara, D.K., Chen, J.M., and Sun, T.S., App. Surface Science, 3, 88 (1979).Google Scholar
16. Schmidt, R.G. and Bell, J.P., in Adv. in Polymer Science 75, ed. Dusek, K. (Springer-Verlag, New York, 1986) p.35.Google Scholar
17. Kerr, C., MacDonald, N.C. and Orman, S., July Appl. Chem., 17, 62 (1967).Google Scholar
18. Apiella, A. and Nicolais, L., in Adv. in Polymer Science 72, ed. Dusek, K. (Springer-Verlag, New York, 1985) p70.Google Scholar
19. Belton, D.J., Sullivan, E.A. and Molter, M.J., Proc. IE Int'l Elec. Manuf. Symp., 158 (1987).Google Scholar
20. Beltcn, D.J., Proc. IEEE Int'l Elec. Manuf. Symp., 242 (1986).Google Scholar
21. Marsh, L.L., Lasky, R., Seraphim, D.P. and Springer, G.S., IBM Inl. Res. Development, 28, 655 (1984).Google Scholar
22. Pope, D.E. and Cliftcn, L.M., Proc. IE Int'l Elec. Manuf. Tech. Symp., 89 (1988).Google Scholar
23. Kinsman, K.R., Natarajan, B., and Gealer, C.A., Thin Solid Films, 166 83 (1988).Google Scholar
24. Sargent, J.P., Adhesion Joints, ed. Mittal, K.L., (Plenum Press, New York 1984) 151.Google Scholar
25. Saiki, A. and Harada, S., J. Electrochem. Soc. (Sol. State Science), 129, 2279 (1982).Google Scholar