Article contents
Modeling of Dislocation Mobility in Metals: Effect of Obstacles and Thermal Processes
Published online by Cambridge University Press: 14 March 2011
Abstract
Thermally activated dislocation glide velocity through weak point obstacle arrays is studied analytically and computationally. Thermal activation rate is estimated using the modified Friedel relations under the weak obstacle approximation. The average flight velocity after an activation event as a function of stress and temperature is obtained by the discrete dislocation dynamics (DD). This numerical calculation includes the effect of self-stress, interaction with electrons and phonons, and the inertial effect. These results are implemented into a phenomenological model to study the dislocation velocity under various conditions. The model can reproduce both obstacle control and drag control motion in low and high velocity regions, and a flow stress anomaly at transient regions.
- Type
- Research Article
- Information
- Copyright
- Copyright © Materials Research Society 2001
References
REFERENCES
- 1
- Cited by