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Mode–I Fracture Toughness of Tetrahedral Amorphous Diamond-like Carbon (ta-C) MEMS

Published online by Cambridge University Press:  01 February 2011

K. Jonnalagadda ,
S.W. Cho ,
I. Chasiotis ,
T.A. Friedmann  and
J.P. Sullivan
K. Jonnalagadda
Affiliation:
Mechanical and Aerospace Engineering, University of Virginia
S.W. Cho
Affiliation:
Mechanical and Aerospace Engineering, University of Virginia
I. Chasiotis
Affiliation:
Mechanical and Aerospace Engineering, University of Virginia
T.A. Friedmann
Affiliation:
Sandia National Laboratories, Albuquerque, New Mexico
J.P. Sullivan
Affiliation:
Sandia National Laboratories, Albuquerque, New Mexico
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Abstract

Mode-I fracture toughness studies were conducted on hydrogen-free tetrahedral amorphous diamond-like carbon (ta-C) MEMS specimens of various thicknesses. Mathematically sharp edge pre-cracks were generated through micro indentation on the Silicon dioxide sacrificial layer. An atomic force microscope (AFM) was employed to measure the precise length and orientation of each pre-crack. Upon wet etching and release the freestanding uniform width and varying thickness MEMS-scale specimens were tested in Mode-I using a custom-made micro-tensile tester. Fracture toughness values were computed from the test data using linear elastic fracture mechanics (LEFM) for a finite width specimen with an edge crack in the fixed grip loading configuration. The average Mode-I fracture toughness for 0.5 micron thick specimens was found to be while the average mode-I fracture toughness for 1 micron specimens was .

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 854: Symposium U – Stability of Thin Films and Nanostructures , 2004 , U9.7
Copyright
Copyright © Materials Research Society 2005

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References

REFERENCES

1. Sullivan, J.P., Friedmann, T.A., de Boer, M.P., La Van, D.A., Hohlfelder, R.J., Ashby, C.I.H., Dugger, M.T., Mitchell, M., Dunn, R.G. and Magerkurth, A.J., Mat. Res. Soc. Symp. Proc. 657, (2001).Google Scholar
2. Chasiotis, I., Cho, S.W., Friedman, T.A., Sullivan, J.P., Mat. Res. Soc. Symp. Proc. 795, 2004.Google Scholar
3. LaVan, D.A., Padera, R.F., Friedmann, T.A., Sullivan, J.P., Langer, R., Kohane, D. S., Biomaterials 26, pp.465–473, (2005).Google Scholar
4. Webster, J.R., Dyck, C.W., Sullivan, J.P., Friedmann, T.A., and Carton, A.J., Electronic Letters 40 (1), (2004).Google Scholar
5. Drory, M.D., Dauskardt, R.H., Kant, A., and Ritchie, R.O., Journal of Applied Physics 78(5), (1995).Google Scholar
6. Sussmann, R.S. et al., Diamond and Related Materials 3, pp. 303–312, (1994).Google Scholar
7. Jiang, Z., Lu, F.X., Tang, W.Z., Wang, S.G., Tong, Y.M., Huang, T.B., and Liu, J.M., Diamond and Related Materials 9, (2000).Google Scholar
8. Chasiotis, I., Micromechanics and Nanoscale Effects: MEMS, Multi–Scale Materials and Micro-Flows, edited by Harik, V. M., Luo, L.-S., (Kluwer Academic Press), pp. 3–37, (2004).Google Scholar
9. Ballarini, R., Mullen, R. L., Yin, Y., Kahn, H., Stemmer, S., Heuer, A.H., J. of Mat. Res. 12 (4), (1997).Google Scholar
10. Espinosa, D. and Peng, B., Mat. Res. Soc. Symp. Proc. 795, Boston, MA, (2004).Google Scholar
11. Kahn, H., Ballarini, R. and Heuer, A.H., Mat. Res. Soc. Symp. Proc. 657, pp. 13–18, (2001).Google Scholar
12. Kahn, H., Tayebi, N., Ballarini, R., Mullen, R.L., Heuer, A.H., Sensors and Actuators A -Physical 82 (1–3), pp. 274–280, (2000).Google Scholar
13. Chasiotis, I., Cho, S.W., Jonnalagadda, K., and McCarty, A., Proc. of the Soc. for Exp. Mech., pp. 37–45, X Intl. Cong., CA, June 7–10, (2004).Google Scholar
14. Tada, Hiroshi, Paris, Paul C., and Irwin, George R., “The Stress Analysis of Cracks Handbook,” Third Edition, ASME Press, pp. 52–53, (2000).Google Scholar