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Microstructural Control through Diffusion-Induced Grain Boundary Migration

Published online by Cambridge University Press:  22 February 2011

Carol A. Handwerker  and
John W. Cahn
Carol A. Handwerker
Affiliation:
Institute for Materials Science and Engineering, National Bureau of Standards, Gaithersburg MD 20899
John W. Cahn
Affiliation:
Institute for Materials Science and Engineering, National Bureau of Standards, Gaithersburg MD 20899
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Abstract

Diffusion-induced grain boundary migration (DIGM) is a common, but only recently discovered low temperature phenomenon that results in high rates of both chemical mixing (or unmixing) and grain boundary migration. DIGM is found in many situations where chemical heterogeneities lead to diffusion. For example, DIGM is observed during diffusion and compound formation in polycrystalline multilayer contact systems produced by low temperature deposition techniques. The diffusional mixing along the moving grain boundary is high, localized, and results in a distinctive composition profile behind the moving interface. Theory has indicated, and experiments have confirmed, which conditions lead to DIGM and which conditions suppress it. The microstructural changes can result in either a grain refinement as seen in many metallic systems or in enhanced grain growth as seen in polysilicon. In either case these microstructural and compositional changes are controllable in a way that may allow fabrication of unique devices.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 106: Symposium G – Polysilicon Films and Interfaces , 1987 , 127
Copyright
Copyright © Materials Research Society 1988

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References

REFERENCES

1. Handwerker, C. A., in Diffusion Phenomena in Thin Films, edited by Gupta, D. and Ho, P. S., (Noyes Publications, New Jersey, 1987), in press.Google Scholar
2. Tashiro, K. and Purdy, G. R. Scripta Metall. 21 361 1987.Google Scholar
3. denBroeder, F. J. A. and Nakahara, S., Scripta Metall. 17, 399 (1983).Google Scholar
4. Kirsch, R. G., Poate, J. M., Eibschutz, M., Appl.Phys.Lett. 29, 772 (1976).Google Scholar
5. See, for example: Gupta, D., Campbell, D. R., Ho, P.S. in: Thin Films-Interdiffusion and Reaction, edited by Poate, J.M., Tu, K.N., and Mayer, J.W. (John Wiley, New York, 1978), 119–160.Google Scholar
6. John Cahn, W., Acta Met. 7 18 (1959).Google Scholar
7. Hillert, M., Scripta Metall. 17, 237 (1983).Google Scholar
8. Handwerker, C. A., Cahn, J. W., Yoon, D. N. and Blendell, J. E., in Diffusion in Solids: Recent Developments, edited by Dayananda, M. A. and Murch, G. E. (The Metallurgical Society, 1985), p. 275–292.Google Scholar
9. Yoon, D. N., Cahn, J. W., Handwerker, C. A., Blendell, J. E. and Baik, Y. J., in Interface Migration and Control of Microstructure edited by Pande, C. S., Smith, D. A., King, A. H., and Walter, J. (American Society for Metals, 1986), p. 1–13.Google Scholar
10. Baik, Y. J. and Yoon, D. N., Acta Metall. 33 1911 (1985).Google Scholar
11. Rhee, W.-h., Song, Y.-d., and Yoon, D. N., Aeta Metall. 35 57 (1987).Google Scholar
12. Bailey, J. E. and Hirsch, P. B., Proc. R. Soc. Lond., 267 11 (1961).Google Scholar
13. Hackney, S. A., Biancaniello, F. S., Yoon, D. N. and Handwerker, C. A., Scripta Metall. 20 937 (1986).Google Scholar
14. Doo, V. Y. and Balluffi, R. W., Acta Metall. 6 428 (1958).Google Scholar
15. Cahn, J. W. and Balluffi, R. W., Scripta Metall. 13 499 (1979).Google Scholar
16. Chou, T. C., Wong, C. Y., Tu, K. N., J. Appl. Phys. 62 2722 (1987).Google Scholar
17. Tu, K. N., Tersoff, J., Chou, T. C., and Wong, C. Y., Abstract G3.9, Materials Research Society, Fall, Nov. 30- Dec. 5, 1987.Google Scholar
18. Vaudin, M. D., Handwerker, C. A., and Blendell, J. E. in Interface Science and Engineering, edited by Sass, S. A., to be published in J. de Phys. Colloque, 1987.Google Scholar
19. Tu, K. N., J.Appl.Phys. 48 3400 (1977).Google Scholar
20. den Broeder, F. J. A., Klerk, M., Vandenberg, J. M., Hamm, P. A., Acta Metall. 31 285 (1982).Google Scholar