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A Microstruciure Investigation on Rapidly Solidified Ni3Al Containing Boron

Published online by Cambridge University Press:  21 February 2011

K.M. Ciiang
Affiliation:
General Electric Corporate Research and Development, Schenectady, New York, 12301USA
S.C. Huang
Affiliation:
General Electric Corporate Research and Development, Schenectady, New York, 12301USA
A.I. Taub
Affiliation:
General Electric Corporate Research and Development, Schenectady, New York, 12301USA
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Abstract

A small amount of boron addition in rapidly solidified Ni3 Al has been found to yield remarkable improvements in bolh room-temperature strength and ductility. In this study, the microstructure of melt-spun Ni3Al ribbons with various boron modifications ranging from 0 to 6.0 at% was investigated in detail by using transmission electron microscopy. All alloy compositions studied reveal a completely ordered fcc L12 matrix phase, in which polygonized dislocation networks and subgrain boundaries are observed. The boron-free Ni3 Al contains a dispersion of an Al-rich martensitic phase consisting of alternate twins. The boron addition tends to suppress the formation of the martensitic phase, but excessive boron (≥ 2.0 at%) causes the precipitation of M23B6 type borides.

Type
Research Article
Copyright
Copyright © Materials Research Society 1984

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References

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