Hostname: page-component-78c5997874-8bhkd Total loading time: 0 Render date: 2024-11-05T10:15:22.175Z Has data issue: false hasContentIssue false

Microroughness at the Si/SiO2 Interface from Pre-Oxidation Annealing, Measured Using Quantum Oscillations in Fowler-Nordheim Tunneling Currents

Published online by Cambridge University Press:  25 February 2011

J. C. Poler
Affiliation:
Department of Chemistry, Venable Hall, University of North Carolina Chapel Hill, NC 27599–3290
K. K. McKay
Affiliation:
Department of Chemistry, Venable Hall, University of North Carolina Chapel Hill, NC 27599–3290
E. A. Irene
Affiliation:
Department of Chemistry, Venable Hall, University of North Carolina Chapel Hill, NC 27599–3290
Get access

Abstract

As design rules shrink to conform with ULSI device dimensions, gate dielectrics for MOSFET structures are required to be scaled to even thinner proportions. Upon scaling the gate oxides below ∼60Å some properties of the device, such as interface roughness, that are negligible for thicker films become critical and must be evaluated. Microroughness at the interface of ultrathin MOS capacitors has been shown to degrade these devices.

We are studying the interfacial region of ∼50Å SiO2 on Si using the quantum oscillations in Fowler-Nordheim tunneling currents. The oscillations are sensitive to the electron potential and abruptness of the film and its interfaces. In particular, inelastic scattering and/or thickness inhomogeneities in the film will reduce the amplitude of the oscillations. We are using the amplitude of the oscillations to examine the degree of microroughness at the interface that results from a pre-oxidation high temperature anneal in an inert ambient containing various amounts of H2O. Preliminary AFM imaging has shown correlations supporting our microroughness interpretation of the quantum oscillation amplitudes.

Type
Research Article
Copyright
Copyright © Materials Research Society 1993

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

REFERENCES

Grunthaner, F.J. and Grunthaner, P.J., Materials Sciences Reports 1, (North Holland, Amsterdam, pp. 6568.Google Scholar
2. Kobeda, E. and Irene, E.A, J. Vac Sci. Technol. B 6, 574 (1988).CrossRefGoogle Scholar
3. Offenberg, M., Liehr, M. and Rubloff, G.W., J. Vac. Sci. Technol. A 9, 1058 (1991).CrossRefGoogle Scholar
4. Liehr, M., Offenberg, M., Kasi, S.R., Rubloff, G.W. and Holloway, K., Extended Abstracts of the 22nd Conference on Solid State Devices and Materials, 1099 (1990).Google Scholar
5. Smith, F.W. and Ghidini, G., J. Electrochem. Soc. 129, 1300 (1982).CrossRefGoogle Scholar
6. Poler, J.C. and Irene, E.A, Materials Research Soc. Proc B, Spring (1992).Google Scholar
7. Fowler, R.H. and Nordheim, L., Proc. Roy. Soc. A119, 173 (1928).Google Scholar
8. Maserjian, J. and Zamani, N., Appl. Phys. Lett. 25, 50 (1974).Google Scholar
9. Kern, W. and Puotinen, D.A, RCA Rev. 31, 187 (1970).Google Scholar
10. Chongsawangvirod, S., Irene, E.A, Kalnitsky, A., Tay, S.P. and Ellul, J.P., J. Electrochem. Soc 137, 3536 (1990).Google Scholar
11. Sune, J., Placencia, I., Farres, E., Barniol, N. and Aymerich, X., Phys. Stat. Sol. (a) 109, 479 (1988).Google Scholar