Hostname: page-component-586b7cd67f-t8hqh Total loading time: 0 Render date: 2024-11-29T09:54:05.804Z Has data issue: false hasContentIssue false
  • English
  • Français

Microprobing of Interfacial Behavior of Solid Polymers by Means of Normal Mechanical Contacts

Published online by Cambridge University Press:  17 March 2011

Y. S. Garif ,
W. W. Gerberich ,
C. W. Macosko  and
A. Pocius
Y. S. Garif
Affiliation:
Dept. of Chemical Engineering and Materials Science, University of Minnesota Minneapolis, MN 55455, U.S.A.
W. W. Gerberich
Affiliation:
Dept. of Chemical Engineering and Materials Science, University of Minnesota Minneapolis, MN 55455, U.S.A.
C. W. Macosko
Affiliation:
Dept. of Chemical Engineering and Materials Science, University of Minnesota Minneapolis, MN 55455, U.S.A.
A. Pocius
Affiliation:
3M Company, Adhesive Technologies Center St. Paul, MN 55144, U.S.A.
Get access

Abstract

Adhesion properties of acrylic pressure sensitive adhesives were examined by means of normal (JKR) contact at room temperature. Cylindrically shaped samples were synthesized in capillary tubes in presence of a cross-linking agent in order to obtain an elastic response. The results reveal power law increase of adhesion at higher rates of interfacial separation. Transition from low- to high-power is revealed and explained as a result of bulk shielding of interfacial fracture mechanism. Further results will be available soon. Bulk viscoelastic dissipation and molecular interactions at the interface are thought to jointly govern this behavior.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 710: Symposia DD – Polymer Interfaces and Thin Films , 2001 , DD7.5.1
Copyright
Copyright © Materials Research Society 2002

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

REFERENCES

1 Pocius, A. V., Adhesion and Adhesives Technology Intro, (Hanser, New York, 1997).Google Scholar
2 Gerberich, W. W., communication with adviser.Google Scholar
3 Gennes, P.-G. de, Langmuir, 12, 4497–4511 (1996).Google Scholar
4 Johnson, K. L., Kendall, K., Roberts, A. D., Proc. R. Soc., A324, 301–312 (1971).Google Scholar
5 Shull, K. R., at.al, Macromol. Chem. Phys., 199, 489–511 (1998).Google Scholar
6 Gent, A. N., Lai, S.-M., J. Polym. Sci.: Part B: Polym. Phys., 32, 1543–1555 (1994).Google Scholar
7 Ahn, D., Shull, K.R., Langmuir, 14, 3637–3645 (1998).Google Scholar
8 Lakrout, H., Sergot, P., Creton, C., J. Adhesion, 69, 307–359, (1999).Google Scholar
9 Johnson, K. L., Adhesion at the contact of solids, (Theoretical and Applied Mechanics, Amsterdam, 1976) p.133.Google Scholar
10 Barthel, E., J. Colloid Interface Sci., 200, 7–18 (1998).Google Scholar
11 Johnson, K. L., Kendall, K., Roberts, A. D., Proc. R. Soc., A324, 301–312 (1971).Google Scholar
12 Maugis, D., J. Colloid Interface Sci., 150, 243–269 (1992).Google Scholar
13 Greenwood, J. A., Johnson, K. L., J. Phys. D: Appl. Phys., 31, 3279–3290 (1998).Google Scholar
14 Derjaguin, B. V., Muller, V. M., Toporov, Y. P., J. Colloid Interface Sci., 67, 326–378 (1975).Google Scholar
15 Falsafi, A., Ph.D. Thesis (University of Minnesota, Minneapolis, 1998).Google Scholar
16 Li, L., Ph. D. Thesis (University of Minnesota, Minneapolis, 2000).Google Scholar
17 Mesarovic, S. Dj., Johnson, K. L., J. Mech. Phys. Solids, 48, 2009–2033 (2000).Google Scholar
18 Cole, P. J., personal communication.Google Scholar
19 Cook, R. F., personal communication.Google Scholar
20 Wade, L. G. Jr, Organic Chemistry (4th Ed., Prentice-Hall, New Jersey, 1999).Google Scholar