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Metallo-Organic Decomposition (MOD) Films for Electronic Packaging

Published online by Cambridge University Press:  25 February 2011

Geraldine M. Vest ,
V. P. Cone ,
C. J. Herzfeld  and
A. K. Bhansali
Geraldine M. Vest
Affiliation:
Purdue University W. Lafayette, IN 47907
V. P. Cone
Affiliation:
Purdue University W. Lafayette, IN 47907
C. J. Herzfeld
Affiliation:
Purdue University W. Lafayette, IN 47907
A. K. Bhansali
Affiliation:
Purdue University W. Lafayette, IN 47907
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Abstract

A metallo-organic decomposition (MOD) film is one formed by thermal decomposition of a solution containing one or more metallo-organic compounds that were deposited onto a substrate. This process yields metal, glasses, or polycrystalline ceramic films directly without passing through the powder stage. Conductor films studied include a screen printable gold and a screen printable and ink jet printable silver. Dielectric films studied include a low K lead borosilicate glass and a variety of ferroelectric compositions.

Type
Articles
Information
MRS Online Proceedings Library (OPL) , Volume 72: Symposium G – Electronic Packaging Materials Science II , 1986 , 47
Copyright
Copyright © Materials Research Society 1986

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References

1. Vest, G.M. and Singaram, S., “Synthesis of Metallo-Organic Compounds for MOD Powders and Films”, MRS Proceedings, Symposium L: Defect Properties and Processing of High-Technology Nonmetallic Materials, Boston, MA, Dec 2–4, 1985.Google Scholar
2. Vest, R.W., Tweedell, E.P. and Buchanan, R.C., “Ink Jet Printing of Hybrid Circuits”, Int. J. Hybrid Microelectronics, 6[1], 261–267 (1983).Google Scholar
3. Turkdogan, E.T., “Physical Chemistry of High Temperature Technology”, Chapter 1, Academic Press, New York (1980).Google Scholar
4. Gaskell, D.R., “Introduction to Metallurgical Thermodynamics”, 2nd Edition, Chapter 10, McGraw-Hill, New York, (1981).Google Scholar
5. Vest, G.M. and Vest, R.W., “A Generic Gold Conductor from Metallo-Organic Compounds”, Intl. J. Hybird Microelectronics, 5[2], 62–68 (1982).Google Scholar
6. Vest, R.W. and Vest, G.M., “Metallo-Organic Materials for Improved thick Film Reliability”, Final Technical Report 4/7/85, Naval Avionics Center, Indianapolis, IN., Contract No. N00163–83-C-0167.Google Scholar
7. Cone, V.P., “The Effect of Bismuth Concentration on the Adhesion of Gold Conductors Produced from Metallo-Organic Compounds on Alumina”. M.S. Dissertation Purdue University, Dec. 1982.Google Scholar
8. Vest, G.M., “Metallization with Generic Metallo-Organic Inks”, Proceeding of the Flatplate Array Project Research Forum on Photovoltaic Metallization Systems, March 16–18, 1983, Pine Mountain, GA (DOE/JPL -1012–92).Google Scholar
9. Vest, G.M. and Vest, R.W., “MOD Silver Metallization for Photovoltaics”, Final Technical Report, 7/1/85, JPL Flat Plate Solar Array Project, Pasadena, CA, DOE/JPL-956679–84.Google Scholar
10. Sabo, C.J., Vest, G.M., Singaram, S. and Mis, D., “Silver Thick Film Metallization for photovoltaics fired at 300°C”, Proceedings of the International Society for Hybrid Microelectronics Symposium, Nov. 11–14, 1985, Anaheim, CA.Google Scholar
11. Herzfeld, C.J., “Applications of Metallo-Organics to Ruthenium Dioxide/Lead Borosilicate Glass Thick-Film Resistor Inks”, M.S. Thesis, Purdue University, May 1985.Google Scholar