Hostname: page-component-586b7cd67f-tf8b9 Total loading time: 0 Render date: 2024-11-29T09:17:21.638Z Has data issue: false hasContentIssue false
  • English
  • Français

Metal Reinforced Diamond Composite Films

Published online by Cambridge University Press:  22 February 2011

C. Tsai ,
J. Nelson ,
W. Gerberich ,
J. Heberlein  and
E. Pfender
C. Tsai
Affiliation:
Department of Chemical Engineering and Materials Science, University of Minnesota, Minneapolis, MN 55455
J. Nelson
Affiliation:
Department of Chemical Engineering and Materials Science, University of Minnesota, Minneapolis, MN 55455
W. Gerberich
Affiliation:
Department of Chemical Engineering and Materials Science, University of Minnesota, Minneapolis, MN 55455
J. Heberlein
Affiliation:
Department of Mechanical Engineering, University of Minnesota, Minneapolis, MN 55455
E. Pfender
Affiliation:
Department of Mechanical Engineering, University of Minnesota, Minneapolis, MN 55455
Get access

Abstract

A three-step process for producing a composite diamond film is presented. Plasma deposited diamonds are reinforced by an electroplated metal binder and the diamonds regrown to produce a continuous, strongly adhered diamond film on molybdenum and tungsten substrates. Microscratching and pin-on-disk testing indicate that the composite films are more adherent than plasma deposited diamonds alone.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 239: Symposium D – Thin Films: Stresses and Mechanical Properties III , 1991 , 275
Copyright
Copyright © Materials Research Society 1992

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

REFERENCES

1. Soderberg, S., Gerendás, A. and Sjostrand, M., Vacuum 41, 1317 (1990).CrossRefGoogle Scholar
2. Ong, T.P. and Chang, R.P.H., Appl. Phys. Lett. 58, 358 (1991).CrossRefGoogle Scholar
3. Matsumoto, S., Hiño, M. and Kobayashi, T., Appl. Phys. Lelt. 51, 737 (1987).CrossRefGoogle Scholar
4. Meyer, D.E., Dillon, R.O. and Woollam, J.A., J. Vac. Sci. Technol. A7, 2325 (1989).CrossRefGoogle Scholar
5. Wu, T., J. Mater. Res. 6, 407 (1991).CrossRefGoogle Scholar
6. Tsai, C., Ventakataraman, S., Nelson, J. C., Gerberich, W., Lu, Z., Heberlein, J. and Prender, E., in preparation.Google Scholar