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Mechanics Of Interfacial Crack Propagation In Microscratching

Published online by Cambridge University Press:  15 February 2011

Maarten P. de Boer ,
John C. Nelson  and
William W. Gerberich
Maarten P. de Boer
Affiliation:
present address - Sandia National Laboratories, Albuquerque, NM 87185 MS 1413
John C. Nelson
Affiliation:
Dept. of Chemical Engineering and Materials Science, University of Minnesota, Minneapolis, MN 55455.
William W. Gerberich
Affiliation:
Dept. of Chemical Engineering and Materials Science, University of Minnesota, Minneapolis, MN 55455.
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Abstract

A new probing technique has been developed to test thin film mechanical properties. In the Microwedge Scratch Test (MWST), a wedge shaped diamond indenter tip is drawn along a fine line, while simultaneously being driven into the line. We compare microwedge scratching of Zone 1 and Zone T thin film specimens of sputtered W on SiO2. Symptomatic of its poor mechanical properties, the Zone 1 film displays three separate crack systems. Because of its superior grain boundary strength, the Zone T film displayed only one of these - an interfacial crack system. Using bimaterial linear elastic fracture mechanics, governing equations are developed for propagating interfacial cracks, including expressions for strain energy release rate, bending strain, and mode mixity. Grain boundary fracture strength information may be deduced from the Zone 1 films, while adhesion may be inferred from the Zone T films.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 436: Symposium CC – Thin Films Stresses and Mechanical Properties VI , 1996 , 103
Copyright
Copyright © Materials Research Society 1997

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