Hostname: page-component-78c5997874-94fs2 Total loading time: 0 Render date: 2024-11-17T20:04:54.790Z Has data issue: false hasContentIssue false

Mechanical-to-Electrical Energy Conversion of Thin-Film Piezoelectric Diaphragms

Published online by Cambridge University Press:  26 February 2011

Dylan J Morris
Affiliation:
[email protected], Washington State University, Mechanical and Materials Engineering, Center for Materials Research, 102 Dana Hall, Pullman, WA, 99164-2711, United States, 509-335-2995, 509-335-4145
Michelle C Robinson
Affiliation:
[email protected], Washington State University, Mechanical and Materials Engineering, Pullman, WA, 99164, United States
Leland W Weiss
Affiliation:
[email protected], Washington State University, Mechanical and Materials Engineering, Pullman, WA, 99164, United States
Cecilia D Richards
Affiliation:
[email protected], Washington State University, Mechanical and Materials Engineering, Pullman, WA, 99164, United States
Robert F Richards
Affiliation:
[email protected], Washington State University, Mechanical and Materials Engineering, Pullman, WA, 99164, United States
David F Bahr
Affiliation:
[email protected], Washington State University, Mechanical and Materials Engineering, Pullman, WA, 99164, United States
Get access

Abstract

A micro (∼1 cm3) dynamic heat engine, capable of producing electrical power from lowgrade heat sources, utilizes a micro-machined diaphragm with a piezoelectric element as a The electromechanical coupling of a piezoelectric diaphragm under large initial stresses and/or large deflections – in the membrane limit – is described here. A simple model is derived for electromechanical transduction of a pressurized piezoelectric membrane and an experiment is described to measure it. Electromechanical coupling initially increases as the square of the center-point deflection as the residual stress is overcome. In the limit of large pressures, the electromechanical coupling approaches a limit that is predicted by the model.

Type
Research Article
Copyright
Copyright © Materials Research Society 2007

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

REFERENCES

1. Demir, I., Olson, A.L., Skinner, J.L., Richards, C.D., Richards, R.F., and Bahr, D.F., Microelectronic Engineering 75, 1223 (2004).Google Scholar
2. Weiss, L.W., Cho, J.H., Morris, D.J., Bahr, D.F., Richards, C.D., and Richards., R.F. Proceedings of ASME IMECE 2006, Chicago, IL. IMECE2006–15042.Google Scholar
3. Sheplak, M. and Dugundji, J., J. App. Mech. 65, 107115 (1998).Google Scholar
4. Tong, P. and Huang, W., J. App. Mech. 69, 785789 (2002).Google Scholar
5. Komargiri, U., Begley, M.R., and Simmonds, J.G., J. App. Mech. 72, 203212 (2005).Google Scholar
6. Cho, J., Anderson, M., Richards, R., Bahr, D., and Richards, C., J. Micromech. Microeng. 15, 17971803 (2005).Google Scholar
7. Wang, Q-M., Du, X-H., Xu, B., and Cross, L.E., IEEE Trans. Ultrason., Ferroelect., Freq. Contr. 46, 638646 (1999).Google Scholar
8. Vlassak, J.J. and Nix, W.D., J. Mat. Res. 7, 32423249 (1992).Google Scholar
9. DiGiovanni, M., Flat and Corrugated Diaphragm Design Handbook, (Marcel Dekker, 1982).Google Scholar
10. Aronov, B., J. Acoust. Soc. Am. 114, 792800 (2003).Google Scholar
11. Robinson, M.C., Morris, D.J., Hayenga, P.D., Cho, J.H., Richards, C.D., Richards, R.F., and Bahr, D.F., Applied Physics A: Materials Science and Processing 85, 135140 (2006).Google Scholar