Hostname: page-component-cd9895bd7-hc48f Total loading time: 0 Render date: 2024-12-27T02:34:12.380Z Has data issue: false hasContentIssue false
  • English
  • Français

Mechanical Stress Measurements in Window-Plated Permalloy Thin Film Strips

Published online by Cambridge University Press:  15 February 2011

C. A. Ross
C. A. Ross*
Affiliation:
Komag Inc., 275 S. Hillview Drive, Milpitas, CA 95035
Get access

Abstract

Mechanical stress measurements in long window-plated strips of permalloy have been made and show an anisotropy in the in-plane stresses. The stress parallel to the strip length is independent of the strip width and thickness, and exceeds the in-plane stress perpendicular to the strip length. The difference between the two stresses depends on the ratio of strip width to thickness, and is in agreement with finite element simulations of stress distributions in similar thin film strips which are etched out of a sheet film of the same material. This result allows calculations of intrinsic stress distributions in more complex window-plated structures. The effect of annealing on the strips is to increase the in-plane stress anisotropy as well as the overall level of stress, by an amount which increases with the annealing temperature.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 308: Symposium M1 – Thin Films: Stresses and Mechanical Properties IV , 1993 , 39
Copyright
Copyright © Materials Research Society 1993

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

REFERENCES

1 Klockholm, E. and Aboaf, J. A., J. Appl. Phys. 52 2474 (1981)CrossRefGoogle Scholar
2 Shirioshi, Y., Shiiki, K., Yuitoo, I., Tanabe, H., Fujiwara, H. and Kudo, M., IEEE Trans. Mag. MAG–20 485 (1984)CrossRefGoogle Scholar
3 Komaki, K., Proc. Symp. Magnetic Materials, Processes and Devices, vol 92–10, 245 (Electrochemical Society, Pennington NJ, 1992)Google Scholar
4 Young, K., Proc. Symp. Magnetic Materials, Processes and Devices, vol 90–8, 137 (Electrochemical Society, Pennington NJ,1990)Google Scholar
5 Young, K., IBM J. Res. Dev. 34 706 (1990)Google Scholar
6 Koyanagi, H., Arai, R., Mitsuoka, K., Fukui, H., Narishige, S.,and Sugita, Y., IEEE Transl J. Mag. Jpn. 5 195 (1990)Google Scholar
7 Klokholm, E. and Krongelb, S., Proc. Symp. Magnetic Materials, Processes and Devices, vol 90–8,125 (Electrochemical Society, Pennington NJ. 1990)Google Scholar
8 Flinn, P. A., Gardner, D. S. and Nix, W. D., IEEE Trans. Electronic Dev. ED–34 689 (1987)Google Scholar
9 Ross, C. A., in press, IEEE Trans. Mag. (1993)Google Scholar
10 Weil, R., Plating 137 (Feb. 1971)Google Scholar
11 Sotirova-Chakarova, G.-S. and Armyanov, S. A., J. Electrochem. Soc. 137 3551 (1990)CrossRefGoogle Scholar
12 Anderson, R.L., Gangulee, A. and Romankiw, L. T., J. Electron. Mater. 2 161 (1973)Google Scholar
13 Kao, A.S. and Kasiraj, P., IEEE Trans. Mag. MAG–27 4452 (1991)Google Scholar