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Mechanical Properties of Microsensor Materials: How to Deal with the Process Dependences?

Published online by Cambridge University Press:  22 February 2011

Stephen D. Senturia
Stephen D. Senturia*
Affiliation:
Barton L. Weiler Professor of Electrical Engineering, Microsystems Technology Laboratories, Department of Electrical Engineering and Computer Science, Massachusetts Institute of Technology, Cambridge, MA, 02139
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Abstract

Microsensors are measurement devices fabricated using planar integrated circuit technology together with enhancements generically called “micromachining”. It is well known that the thin-film materials used in microelectronics can have properties which differ from their bulk counterparts. In addition, thin-film materials exhibit residual stress, which is known to be strongly process dependent. The sensor designer must understand how the detailed process used to fabricate a particular device impacts the specific mechanical properties, hence, the expected mechanical device performance. This paper illustrates the problem of process-dependent material properties using examples of residual stress of several materials, and then presents an object-oriented material-property database which is being developed as part of a CAD system for microelectromechan-ical systems (MEMCAD).

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 239: Symposium D – Thin Films: Stresses and Mechanical Properties III , 1991 , 3
Copyright
Copyright © Materials Research Society 1992

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References

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